Electronics Forum: controllers (Page 241 of 369)

Re: white dirty solder

Electronics Forum | Wed Jan 14 18:47:55 EST 1998 | Graham Naisbitt

Jerry This is the classic "White powder phenomenon" a little like the X files - loads of information but who do you trust? I know that GEC Hirst Research in the UK, identified over 16 different white powder residues so it is not an easy subject. Plea

Placement Program Control

Electronics Forum | Fri Aug 03 22:20:49 EDT 2001 | jbull

Dave, We archive programs as follows. Step1. Perform a successful first piece article Step2: Copy the Program to a password protects network drive. Step3: Run the program in production, from the local drive Step4: After the production run, delet

B.I.C. SMT Process Controls

Electronics Forum | Wed Aug 08 11:52:06 EDT 2001 | Michael Parker

Your reply with the reason for wanting the BIC data finally exposed the root cause of your problem. Good luck with trying to educate your suppliers. I have had copiuos amounts of experience with Asian cultures. First, you gotta know that they have a

Mirror image BGA connectors

Electronics Forum | Thu Aug 09 12:36:26 EDT 2001 | Michael Parker

Adam- Mikie here. I too am placing 2 PBGA sockets on an assembly but they aren't mirror imaged. Thanks to the SMT Gods for that one. You say you added more paste to solve for open solder. Do you have x-ray? Were the alignments perfect? Also the part

Reflow Specs.

Electronics Forum | Thu Jun 13 11:24:25 EDT 2002 | davef

Sorry to hear about the Quality Department thing, but we all have our cross to bear, eh? Through an extended period, say 8 hours, understand change of critical controls in the following: * Conveyor speed. * Side to side temperature differences. * Ti

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Fri Aug 17 01:40:55 EDT 2001 | V.RAMANAND KINI

We are in the watch & clock Business. We have a Watch IC chip that has to be wirebonded using Ultrasonic aluminium wedge bonder. The wire dia is 1.25mil. The PCB is made of G10 Glass epoxy copper clad laminate. The copper thickness is 18 microns. The

Quality control

Electronics Forum | Mon Aug 27 16:13:35 EDT 2001 | seand

Hello Everyone, For QC purposes, there are a couple of methods to both qaulitatively and quantitatively inspect your manufacturing process. For Paste inspcetion, an inline machine like the SE300 by CyberOptics may be appropriate. You may also inco

parts popping off during reflow

Electronics Forum | Thu Sep 13 17:57:59 EDT 2001 | davef

You're correct. It is curious. Possible angles to look at are: 1 WS609 loves moisture in the air. In high humidity shops, this paste hakes-on liquid. If this is the case, you should also see slumping, resulting in fine pitch bridging, and solder

Wave SPC

Electronics Forum | Thu Sep 27 10:28:29 EDT 2001 | John S

It seems to depend on your situation. We're an OEM manufacturer and run the same products for extended periods of time. We monitor process indicators such as Dave listed, but we also monitor process defect trends. This is product specific of cours

Reflow Oven

Electronics Forum | Fri Oct 05 08:35:52 EDT 2001 | Hussman

Hey Steven, Achieving the proper profile like you described does require you to engineer proper conveyor speeds and zone temps. Most conveyorized ovens have the inside of the ovens divided into zones. Each zone has a top and bottom heater that can


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