Electronics Forum | Wed Aug 31 03:35:41 EDT 2005 | Slaine
I have a through hole product that is currently built with HMP solder(93.5Pb,5Sn,Ag1.5). We then dip it in 60/40 SnPb to give a solderable finish as HMP tends to oxidise. We need the HMP as our Customers solder through reflow ovens. Some customers w
Electronics Forum | Wed Sep 07 04:28:26 EDT 2005 | Slaine
were looking at paste, wire, preforms and solder bars (for solder pots), concentraiting on HMP, sn62,96S, and 2 different sac alloys, we also have 7 different fluxes and 16 temination inks (which were also having to change for RoHS because the ink co
Electronics Forum | Thu Nov 17 17:32:07 EST 2005 | russ
Good point tommy, I think we are confusing what we are talking about here. It was not asked if the operators should do inspection. It was asked if an operator should pass boards through a machine. The operator is not inspecting anything just as t
Electronics Forum | Sat Dec 17 11:45:40 EST 2005 | DAM
You know, many SMD components have copper alloy leads and then a copper (or Ni) barrier on them. On the copper (or Ni) barrier there is the finish. Usually the finish is made of Sn\Pb (tin-lead), and if I solder with a Sn\Pb solder paste it's all rig
Electronics Forum | Wed Jan 04 13:47:11 EST 2006 | russ
To answer your question it was mentioned that allowing the boards to cool slightly between reflow and wash may help this case to eliminate thermal shock from immediately going into colder water straight out of the oven with no cooling. In looking at
Electronics Forum | Sun Jan 29 14:10:14 EST 2006 | gipos
Hi GS, We are contract manufacturer for small series of electronic equipment fully trained for SMT.Making mostly RF with only few QFPs,TSOPs...SMT machine assembly was made by local subcontractor when needed. Recently we acquired two Juki 730 machin
Electronics Forum | Sun May 28 19:02:11 EDT 2006 | grantp
Hi, One thing, getting back to the original topic, is you might want to panelize these boards as much as possible, as you don't have too many components, but you have some good volume. So the machine changeover time is going to be an issue. Althoug
Electronics Forum | Fri Jun 09 05:18:07 EDT 2006 | Rob
Hi Shawn, that you're baking the components makes me think that they are either old, or have been sitting around for a while (or none of the above & you are really dilligent!) Whilst baking will sort out the MSD issues (such as popcorning) it will
Electronics Forum | Tue Jul 04 10:48:08 EDT 2006 | Rob
Hi Piet, We looked into this too at some length (we do a lot of FPGA and 16 & 32 bit micro designs) and every semi auto machine we checked out was to be fair, crap. Especially on the number & type of devices you could sucessfully handle, set up & a
Electronics Forum | Wed Aug 16 13:52:24 EDT 2006 | russ
Oven settings are meaningless here. What does the board see? It is the paste we are concerned about not what the heaters are running at hehe. These solder balls are at the end of pad, which end? under the part or away from the part. I believe you
