Electronics Forum | Wed Jul 22 08:52:29 EDT 2009 | spitkis2
Can someone clarify whether IPC-TM-650 Test Method 2.6.27 (Thermal Stress, Convection Reflow Assembly Simultation) is required for all bare board fabricators? Or is this test method optional, depending on the type or class of boards being fabricated
Electronics Forum | Wed Apr 03 18:55:16 EDT 2013 | hegemon
We have had success with both thin folded sheet metal "cans", as well as Aluminum Tape. In some cases it is just not possible to prevent exposure when in convection reflow, so those parts might have a "hand add" instruction for later mounting. 'heg
Electronics Forum | Sat May 15 20:32:55 EDT 2021 | dunks
Could you setup bga rework style machines with custom nozzles? Assuming your manual convection process consists of technicians with hot air pencils, and depending on part locations, this could potentially replace the manual part of that process.
Electronics Forum | Tue Aug 06 08:54:21 EDT 2002 | mike
I have two basic questions: 1. We have a number of small convection ovens and want to modify some of these for baking out parts when needed. We have tried pumping nitrogen into these but I still run between 35 and 50 RH. Has anyone tried converting a
Electronics Forum | Tue Sep 18 10:22:22 EDT 2001 | jschake
Paste Flux / Reflow: Our experiments indicated that the combination of no-clean solder paste and air forced convection reflow produced the fewest tombstone defects, followed by water-soluble paste reflowed in air, and most tombstones occurring with
Electronics Forum | Tue Nov 14 19:59:22 EST 2006 | wchang
Heller 1800S Convection Reflow �� 1996 - 97 vintage �� Dimensions: length 150��, width 53", height 63", �� Number of forced convection zones - top 9, bottom 8 �� Cooling zones: 2 �� Conveyor width (m
Electronics Forum | Mon Aug 25 12:43:35 EDT 2014 | freddimock
Numerous people use the Pyramax oven to process high temp solder but your success will depend upon the mass of your board. To maximize the probability of success you should use the highest convection rate (IWC) possible to enhance heat transfer an
Electronics Forum | Wed Apr 14 13:37:56 EDT 1999 | Mark Charlton
Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? I consider "fines" individual unmelted metal spheres that are found in solder
Electronics Forum | Mon Mar 01 22:37:01 EST 1999 | Dave F
| Hello! SMT professionals, | | I do not know if anyone posted this question before. | Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the hee
Electronics Forum | Thu Nov 21 05:44:07 EST 2002 | kcorrin
We produce several boards with reflowed components on top and bottom. We are finding the solder has wetted to the leads but did not flow completely to the end of the lands. Several factors/causes?: 1) Board warping but paste deposits look good. 2) Mo
