Electronics Forum | Sat Feb 05 09:13:39 EST 2000 | Dave F
Hany: In response to your questions: 1- In a double wave solder M/C, is possible to completely eliminate the second wave without affecting the quality of the solder joints? Many w/s machines have a turbulent wave and a smooth wave. The turbule
Electronics Forum | Tue Nov 02 17:52:17 EST 1999 | Dave F
Jim: Several points: 1 If you�re correct about corrosion of your component leads (which is entirely possible if the leads are steel, as you say), then the AIM 264-5 no-clean may not be aggressive enough to remove the corrosion you are seeing routin
Electronics Forum | Tue Oct 12 16:08:44 EDT 1999 | Brian
| I need your help! We have been doing double sided surface mount for 4 years now. Up until 6 months ago I have not had a tombstoning problem. Since then I have a fairly high incidence rate of tombstones on the 0603 size resistors (no other parts).
Electronics Forum | Sat Oct 09 04:17:21 EDT 1999 | Brian
| Can anyone tell me the formula/method to determine | the amount of weight that solder's surface tension can support. | (ie: Maximum weight of components soldered onto a bottom side | of a board during a top side reflow on a Paste/Paste process). |
Electronics Forum | Sat Oct 09 07:33:23 EDT 1999 | Dave F
| | Can anyone tell me the formula/method to determine | | the amount of weight that solder's surface tension can support. | | (ie: Maximum weight of components soldered onto a bottom side | | of a board during a top side reflow on a Paste/Paste proc
Electronics Forum | Fri Oct 08 16:36:28 EDT 1999 | Glenn Robertson
| We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost 7
Electronics Forum | Fri Oct 08 16:36:59 EDT 1999 | Dave F
| We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost 7
Electronics Forum | Mon Oct 11 08:34:52 EDT 1999 | C.K.
Thanks for the acvice, Dave and John. Like I stated above, I didn't feel comfortable with changing wave parameters since I knew that we'd be compromising our wave quality. I'll try the peelable mask thing, reprofile, and let you guys know what i fo
Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
