Electronics Forum: conveyor (Page 96 of 159)

Re: Vectra Wave

Electronics Forum | Fri May 05 11:58:25 EDT 2000 | John Sims

We are using NR300F from Alpha. Topside board temp is 220 deg. F. We have 3 bottom side convection preheaters, and we use a foaming fluxer. The machine (except for the rotary chip wave) is almost identical to the old econopak. An electrovert appl

Re: Fluxes

Electronics Forum | Thu Mar 23 00:37:47 EST 2000 | Donnie DeYoung

Thanks guys. We are currently using an Opti Flux fixed spray head at 10 to 20 psi. We were using the 351 flux at 60 psi before this, so as you can see we found that there's a huge difference here. We are currently running a conveyor speed at 5.0 FPM.

Re: Convection Oven Reflow Modeling Simulations

Electronics Forum | Wed Feb 23 20:29:43 EST 2000 | Rex B

ECD is working on some tools in the area of determining the Ideal or most Robust Profile, for a given paste, oven configuration and conveyor speed. Translation of this "most robust profile" into actual oven setting requires more knowledge about the

Wavesoldering SPC

Electronics Forum | Fri Jan 26 08:28:59 EST 2001 | Sal

I am currently in the Process of setting up some SPC software on our Wavesoldering equipment. What I would like to know for each Parameter that is listed below what kind of variation from my average setpoint would cause defects.Example. If the averag

Wavesoldering SPC

Electronics Forum | Mon Jan 29 04:27:47 EST 2001 | wbu

Hi Sal, taking the dwell time as parameter to control seems to me unessary. Dwell time is a function of other settings that can be controlled (adjusted) more easily (conveyor speed, wavehight-settings, angle). Although dwell time is essential it�s I

Solder balls on solder side!!

Electronics Forum | Wed Feb 28 19:48:11 EST 2001 | davef

If we were talking about a single board problem, we�d be thinking about the laminate, but since you imply the problem is broad-based across multiple assemblies, consider the following machine parameters: * Crank-up preheat time / temperature to driv

no contact on BGA

Electronics Forum | Fri Jun 29 18:43:16 EDT 2001 | procon

Dear Danial, The only stupid thought is the one left only as a thought and not asked. The size of the board and the placement of the BGA on the board could play a big factor during reflow. If you are processing boards on an edge conveyor and the boa

Mixed tech. wave defects - HELP

Electronics Forum | Mon Jun 25 10:35:39 EDT 2001 | rkevin

Despite all my efforts I cannot eliminate icycling on my t/h leads. They come and go.... daily, lots of rework. I have eliminated the following from the scenrio: Inadequate flux to promote quick drainage, Pot temperature too low, Soldering surface

Mixed tech. wave defects - HELP

Electronics Forum | Mon Jun 25 11:26:36 EDT 2001 | wbu

What about conveyor speed? I tried to manage that the speed of the board and the speed of the wave were nearly the same at that point where the leads are leaving the wave. But actually I haven�t seen icycling except at one time and that was solved r

SMT PCA to chassis reflow

Electronics Forum | Wed Jul 04 14:22:51 EDT 2001 | davef

I just rooted through an analysis that we did five or six years ago [so current it aint] and finally found the goods. We talked to Vitronic, Heller, Electrovert, IR, and Conceptronic. Only Electrovert had a 2.75" throat [rail to top of board cleara


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