Electronics Forum: conveyor and oven and error and 2 (Page 1 of 1)

AXI and AOI

Electronics Forum | Tue Jul 09 15:20:19 EDT 2002 | pjc

When you look at the capabilities of Combo machines they tend to sacrifice performance when compared to separate X-ray and AOI machines, meaning they don't do either the X-ray or AOI operations as well as a machine that was designed to do only one. A

BGA ball and PCB pad

Electronics Forum | Fri Feb 27 11:33:32 EST 2004 | Bryan

Very strange question,but interesting.Is there anyone who have conducted any experiments to figure out the results?I made a profile board,one thermal couple on pad and other one drilled into the ball of BGA.the 2 points are perpendicular to conveyor

Printer and Reflow Oven Recommendations

Electronics Forum | Fri May 15 21:39:48 EDT 2015 | jlawson

Reflow.. 1.Rehm (Germany) - Best in Class Best overall process stability heating system ( Alot of makers have started to copy there VX heating arrangement ). COnveyor chains can be a bit more attention in terms of maintenance on rehm , but if foll

Puzzling CSM84VZ errors, #118 and #120

Electronics Forum | Mon Nov 14 00:13:55 EST 2011 | tpappano

Hi Jeff, I pulled the proms from both machines, copied to disk, re-burned the the old versions with the newer and reinstalled. The ram became scrambled in the upgraded unit on startup, but I did a full restore through the serial port and unit #2 got

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW

Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)

Reflow Temperatures and speed for a 7 zone top/bot for conceptro

Electronics Forum | Wed Jun 25 18:17:48 EDT 2003 | Brian W.

Water soluble pastes generally work best with a ramp-to-spike reflow profile. Check your paste manufacturer's recommended profile. There are many factors that impact your profile; board thickness, component density, buried thermal masses, board si

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