Electronics Forum | Thu Feb 12 22:21:08 EST 2015 | shahrat
So what problems you are facing with Mirtec? Can u check coplanarity, less solder, polarity, dry solder,Pads not properly got the heat for 1005 package. Can u also check 0105 components that is surrounded by some tall components? what about false cal
Electronics Forum | Thu Apr 27 05:45:20 EDT 2017 | pavel_murtishev
methos1979, 1. Mirtec, Marantz 2. Koh Young, Orbotech, Mirtec 3. Koh Young Zenith 4. Definitely Programs for 3D AOI are prepared really faster. Having defined component database, programming takes no more than a couple of hours. Fine tuning takes u
Electronics Forum | Thu May 10 08:15:06 EDT 2018 | kdexter0928
Rob, 1) I have not yet tried treating each side as a large lead. Thats an excellent idea and I will give that a try shortly here. 2) I have skipped the coplanarity check in attempt to get it to place so it is failing the basic version. 3) we are u
Electronics Forum | Wed Oct 17 09:59:12 EDT 2018 | dnachristen
That's incorrect. 3D aoi is extremely useful for determining solder flow and slope which a 2D can't do. Yes it's also great for coplanarity, tomb stoning, head and pillow and a multitude of other defects. Most 3d AOI use cad models and height measure
Electronics Forum | Wed Aug 07 18:25:52 EDT 2019 | slthomas
Normally if the package is defined properly I would expect your machine to place it correctly but we have some parts pushed right down to the pads. If the paste is centered, and the parts are centered, and you have obvious bridging potential coming
Electronics Forum | Tue Jan 14 11:39:51 EST 2020 | avillaro2020
Thanks Robl. I’ve contacted samtec followed their advice but ended up empty handed. Originally my stencil thickness is 6 mils, samtec stressed the need for the paste and charge to have good contact but this is challenged by the inherent charge non-co
Electronics Forum | Mon Aug 14 13:48:03 EDT 2023 | spoiltforchoice
Well gasketing yes, have you dine enough analysis to blame aperture design- Maybe not? Maybe whip out the gerber files for this PCB&stencil and compare the details with one you feel works well. Is there something different about their layout rules o
Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.
Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va
Electronics Forum | Tue Nov 28 22:35:30 EST 2000 | rabell
We are currently in release 1.4 and 1.5 of the majority of our courses, partly because we do fix minor errors that do crop up, and release maintenance updates. I infer from your comment that you take exception to one or more of the test questions in
Electronics Forum | Wed Apr 21 02:53:33 EDT 1999 | Raul N.
25 PPM)! | | | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compe
