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PCB Trace Current Capacity-What Should You Know

https://www.ourpcb.com/pcb-trace-current-capacity.html

. The copper thickness is increased to optimize the production cost modern PCBs offers different copper thickness on a single board. By which the high current paths can be isolated from the low side paths . To determine the trace thickness respective the current needs, and the copper thickness of the board that is being designed. However, a more advanced simulation had to be done to study the effect of high current on other circuitry and heat dissipation factors . As the boards evolved, the copper layer is optimized by spreading. It is over an ample space and high-resolution isolation form low power rails . Content PCB Trace Current Capacity PCB Trace Current Capacity cannot surpass the good old think copper wiring. But it can reduce the space consumption exponentially . Various design aspects and material properties determine the PCB trace current capacity. For example, the most common use 1oz copper offers approximately 500mΩ   per square inch

Copper PCB - 7 Important Issues That Users are Most Concerned About

https://www.ourpcb.com/copper-pcb.html

don’t need countless tones of copper. Each copper circuit board will only require minimal amounts for proper functioning. From this angle, one ounce of copper makes for a copper layer thickness of 35 micrometres, which is enough to cover a whole square footing of a PCB substrate . 2.1When Using Copper, Here’s How to Choose Copper Thickness on a PCB The thickness of a PCB will vary based on the number of copper layers used . For instance, when you have determined that your electronic device’s design will need a bigger current than what a typical PCB can hold. 2.2 Factors to Consider Make sure to consider the following aspects when deciding upon the thickness of copper in your PCB design you’ll be adding copper layers. 2.2.2 Flexibility If you’re looking for flexibility, the thickness of copper will depend on how much flexibility you need . 2.2.3 Space You should always consider how much space you’ll be working with, before determining the copper thickness of your PCB. Thinner boards will easily fit into smaller spaces, and in most cases, small devices do work with thin boards

Hybrid MultiLayer-Laminated PCB - Consistent

http://godwcac.com.tw/engineering/index2.php?id=120

" series Metal based Aluminum based, Copper based,  special alloys based, Laird 1KA04,1KA06, Bergquist MP06503, HT0450 Microwave & RF Rogers RO4350, RO4003, RO3003, RT/duroid, Arlon 85N, 33N, Nelco N4000-13, Panasonic Megtron 4,Megtron 6, Taconic RF35, TUC TU872, EMC EM827 Feature Layers counts 1-40 layers Board thickness 0.13-7.0mm max. board size 21 ±0.1mm bow & twist 0.7%, max.0.1% max. inner layer copper thickness 10 OZ max. inner layer copper thickness 15OZ min prepreg thickness 2mil(0.5oz copper ×59 inch Layup blind/buried vias mechanical drill, laser drill, stacked vias available HDI i+N+i(i>=1),epoxy fill, copper fill,electrochemical plating Surface finish Surface treatment HAL with lead, lead free HAL, flash gold, ENIG, immersion silver, immersion tin, OSP, hard gold plating, hard gold °),0.59(30°),0.77(45°),0.97(60°) inner layer copper separate spacing 8mil outline to inner layer copper 8mil chamfer to gold finger 7mil PAD to PAD distance (ENIG ) 4mil spacing between gold fingers 6mil PAD to PAD distance (HAL) 7mil (to main copper 10mil) peelbale mask to PAD 16mil silkscreen to PAD 6mil between carbon ink 15mil Others min

日本スペリア英語_CID

http://seikausa.com/sites/default/files/documents/nse-lead-free-solder-english.pdf

thickness and smooth bright finish ■Good penetration of even small diameter holes SN100CL for Hot Air Solder Leveling (HASL) Excellent Fluidity Low Copper Erosion SN100CL wets fast but does not erode copper on through hole walls and shoulders. Immersion time 3sec. Immersion time 8sec. 0 5 10 15 20 25 30 0 2 4 6 8 10 ■SN100CL Copper erosion test 【Test conditions】 Solder temperature: 275℃ ●Point of measurement of copper thickness 【Shoulder】 The d is tance a t 45° from the edge of the board to the copper surface Copper plating Copper Land Board ●Measured value  Thickness of remaining copper plating  (average of measurement on 4 shoulders) T hi ck ne ss o f c op pe r la nd (μ m ) Immersion time(S) Copper plating Copper Land Board Solder ■Good drainage ensure test for polyurethane insulated copper wire The thickness of copper wire (originally 80μm) barely changed after immersion in SN100C3. Copper land IMC (Intermetallic compound layer) 10μm Solder bath temperature(℃) Time (s) 260 2 - 5 Package unit 20kg per erosion is reduced by half. ■Evaluation of copper erosion in automatic soldering 54μm (4μm) 46μm (12μm) 54μm (4μm) 42μm (16μm) 49μm (9μm) 30μm (28μm) SN96CI(020) (Sn-3.8Ag-1.0Cu) SN97C(020) (Sn-3.0Ag-0.5Cu) Thickness of remaining copper (Thickness of copper

3D Solder Paste Inspection Using Pad Reference with Multi Angle Sensor Technology | Seika Machinery,

http://seikausa.com/news/3d-solder-paste-inspection-using-pad-reference-multi-angle-sensor-technology

Solder paste inspection (SPI) traditionally uses resist height or a pseudo-pad height to calculate solder volume on a pad. However, as features are increasingly miniaturized and compressed on the PCB, resist thickness differences are making SPI measurements inaccurate . Trends like higher component placement density and smaller components have led to much thinner stencils at solder paste print. Resist thickness differences of PCBs now affect the process significantly * can reference from the pad or copper layer. Solder Volume Measurement In the case of resist reference, the solder that is lower in height compared to the resist surface will not be calculated into the volume measurement . Since the resist thickness will vary some from PCB to PCB, this method cannot measure true solder volume. The height of the pad surface within the PCB will be even, regardless of the existence or nonexistence of the resist layer . When using the resist as reference, the area equivalent to the resist thickness is not recognized as solder. When using the pad as the reference, the area that is not recognized as solder can be minimized. Figure 1A

http://www.soldertools.net/product_images/PCB/circuittracerepair.pdf

. BEST circuit tracks are 4” (102mm) strips of 99.9% pure CDA 11000 copper. The strips have etched backsides that provide a large surface area to adhere the traces to the board . This kit is a great time and labor-saver providing the tools you need to quickly repair missing or damaged circuit traces. The method for repairing damaged circuit traces employs the use of copper circuit tracks which are epoxied to the circuit board ” which are key when performing PCB repairs. Material Specifications 99.9% pure CDA 11000 copper Backside etched for optimal adherence Track Size: 4” (102 mm *Individual items may be purchased separately. Qty Track widths and Thicknesses .002” (0.51mm)width x .005” (1.27mm)thickness .002” (0.51mm)width x .006” (1.52mm)thickness .002” (0.51mm)width x .008” (2.03mm)thickness .002” (0.51mm)width x .010” (2.54mm )thickness .003” (0.76mm)width x .015” (3.81mm)thickness .005” (1.27mm)width x .020” (5.08mm)thickness .005” (1.27mm)width x .030” (7.62mm)thickness 9 9 9 9 9 9 9

Custom Circuit frames for the replacement of SMT pads, traces, fingers and other traces patterns on

http://www.soldertools.net/best-circuit-frame-customizeable/

. Instead of overwhelming you with the hundreds of different patterns and having to pick through them (you can ask for the listing) you simply tell us the following: 1. Thickness/# of oz of copper 2. Plating required 3 . It is a clear 1mil (0.0254mm) in thickness material which helps to make for an aesthetically pleasing repair. Specifications Frame Size: 57 x 38 mm (2.25" x 1.50") Material: Copper foil 0.036 mm (0.0014")-backside micro-etched for enhanced adhesion . We have a variety of eight including both 1, 2 and 4 oz copper as well as both RoHS compatible, standard tin-lead and gold plated versions available . The circuit frames are t in plated with the dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB . 1, 2 and 4 oz copper wights available. Plating: RoHS, gold Backing: Phenolic film adhesive 0.0254 mm (0.001") thick OR they are microetched for 2-part epoxy attachment Electrical Resistivity

Letterhead

http://www.okinternational.com/File%20Library/Metcal/Resources/FAQ/Connection-Validation-Technology.pdf

the intermetallic compound layer. Optical micrographs were taken of all samples. The interfaces between the copper substrate and the solder alloy were sequentially photographed under 500X or 1000X magnifications, depending on the thickness of the intermetallic layer , the solder buttons joined to the copper substrate, the micrographs of the SAC305/Cu interface displaying the intermetallic layer, and the measurements of the intermetallic thickness. The T-t data confirming the soldering cycles are shown in Figure 12 dwells on the copper substrate in the liquid-state at a specific temperature. For the analysis conducted in this work, the thickness of the intermetallic compound layer was measured for the different samples produced at different times and temperatures of the solder and then measuring the thickness of these layers. Most of the literature to-date reported on aged soldered joints to investigate the in-service intermetallic layer growth . After the experiments, the copper substrate/solder alloy interface was examined using light microscopy, scanning electron microscopy (SEM) and SEM-EDS

Microsoft Word - White Paper Hand Soldering with Lead Free Alloys.doc

https://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/White-Paper-Hand-Soldering-with-Lead-Free-Alloys.pdf

transfer efficiency Solder Joint Appearance Generally speaking lead free joints look completely different to tin/ lead joints. Copper Fe Plating Rapid Dissolution of Copper Fe Plating Thickness P la tin g Li fe /T he rm al E ffi ci en cy Plating Life Thermal . Examination of the thickness and morphology of the intermetallic layer in the joint can give a clear indication if the correct amount of thermal energy has been applied to the joint . Controlling the thickness of the intermetallic (rate of reaction) is critical in the formation of a mechanically strong joint. The growth rate of the intermetallic layer is temperature and time dependant . Intermetallic layer thickness can be an indication of joint quality The overall shape and surface finish of the solder joint fillet has traditionally been an indicator to solder joint quality temperature to 40C above the melting point of the solder alloy for 2 to 5 seconds. Most companies that are switching over to lead free manufacturing processes, seem to be opting for the SAC alloys based around the Tin/3.8 Silver/0.7 Copper eutectic

High Performance Shielding Laminates – EM-X700

http://orionindustries.com/pdfs/X700-series.pdf

: Aluminum, Copper, Tin Plated Copper (SnCu) Standard Gauges (Foil): 0.002”, 0.005” EMI/RFI SHIELDING LAMINATES EM-X700 Series Product Data DESCRIPTION . The EM-X700 series of materials offers UL 1950 and UL 746 C performance down to a total thickness of 0.014”. These materials use G.E. Lexan® FR-700 as their insulating substrate . Their increased thickness and stiffness provide additional structural integrity to the finished part. CONFIGURATION: ORION® ORION holds two patents on EMI shield designs Prototypes Within 24 Hours ISO 9002 A3744 O R I O N I N D U S T R I E S I N C O R P O R A T E D One Orion Park Drive . to the International Organization for Standardization, ISO 9002 Standard for Quality. Foil Foil Nom Thk UL94 Flame* RTI Mtl Dsg Col Type Thickness (In.) Class All Properties Polycarbonate (PC) - clad aluminum, copper or tin-plated copper . EM-1710 BK Al 0.002 0.014 94V-0 50 EM-2710 BK Cu 0.002

High Performance EMI/RFI Shielding Laminates – EM-X300

http://orionindustries.com/pdfs/X300-series.pdf

. The EM-X300 series of materials offers UL 1950 and UL 746 C performance down to a total thickness of 0.009”. These materials use G.E. Valox® FR-1 as their insulating substrate : White Insulating Layer Finish: Matte or Polish Standard Roll Widths: up to 48” wide Standard Gauges (insulating layer): 0.005”, 0.010”, 0.015”, 0.020”, 0.030” Available Foils: Aluminum, Copper, Tin Plated Copper . to the International Organization for Standardization, ISO 9002 Standard for Quality. Foil Foil Nom Thk UL94 Flame* RTI Mtl Dsg Col Type Thickness (In.) Class All Properties Polybutylene terephthalate (PBT) - clad aluminum, copper or tin-plated copper . EM-1305 NC Al 0.002 0.009 94V-2 50 EM-2305 NC Cu 0.002

IPC-6012D: Qualification and Performance Specification for Printed Boards

https://store.aciusa.org/IPC-6012D-Qualification-and-Performance-Specification-for-Printed-Boards-P132.aspx

. Revision C incorporates many new requirements in areas such as selection for procurement, new surface finishes, hole plating thickness, measling, weave exposure, copper cap plating of filled holes

Surface Mount International

https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

. However, issues relating to high rates of copper (Cu) dissolution occurring during the PTH rework process using either SAC305 or 405 alloys may force a change in this concept surface and (2) Diffusion into the solder melt. Diffusion controlled processes result in a uniform attack while interface controlled reactions may be recognized by preferential etching of grain boundaries. In this study smooth copper/intermetallic interface of diffusion control, were D is the diffusion coefficient in liquid and δ is the thickness of the effective concentration boundary layer. In general, the boundary layer thickness is less than 0.1mm. This boundary layer is a layer of liquid existing immediately adjacent to the solid copper (Cu) interface/intermetallic layer (Figure 3). The Cu concentration gradient exists within this layer. During the diffusion controlled process the liquid boundary layer which is formed during the solder fountain rework is an important feature of Cu dissolution. Figure 3. Departure and Diffusion of Cu Atoms into Solder Melt (Kinetics of Cu Dissolution) The thickness of this liquid diffusion boundary layer is a function of the physical properties, the velocity of the solution

Electronics in Harsh Environments Conference

https://www.smta.org/harsh/tech2018.cfm

. Alternative solder alloys designed for higher temperatures are needed. Mathias Nowottnick of the University of Rostock will present on transient liquid phase sintering research by combining solid copper powder and liquidus SnAgCu solder . Highly dense assemblies are commonly packaged in designs that are permeable to moisture. While operating in hostile environments, the thickness and coverage variability of conformal coating over components impacts reliability . Phil Kinner of Humiseal will present research that compares and contrasts coating thickness to help the assembler determine optimum levels needed to withstand harsh environments

DS Qualification Performance Specification Rigid Boards

https://www.blackfox.com/ipc-certification/ipc-specialist/ipc-6012-cis-with-space/

: Learners will have the ability to understand criteria such as: Material selection for procurement Surface finishes Hole plating thickness Copper cap plating of filled holes Laminate cracks, voids, measling

IPC/IPC-6012 CERTIFIED IPC SPECIALIST (CIS) - Blackfox.com

https://www.blackfox.com/ipc-certification/ipc-specialist/ipcipc-6012-certified-ipc-specialist/

. Objective Learners will have the ability to understand criteria such as: Material selection for procurement Surface finishes Hole plating thickness Copper cap plating of filled holes Laminate cracks, voids, measling

http://www.zestron.com/fileadmin/Filestorage/RESPONSIVE_Website/2-Products/TIs/EN/productinfo-zestron-coating-layer-test-en.pdf

® Coating Layer Test utilizes a black color reaction as a visual indicator of the defects in the protective coating, even in the case of μ-coatings. The test thus adds the standardized methods for coating thickness measurement by enabling rapid and non-destructive detection of closed and dense coatings : Organic coatings/ Classical solvent coatings µ-coatings based on perfluorinated compounds Parylene Surfaces: Tin Copper Nickel/ Nickel containing compounds Other less noble metals such as ferrite and alloys The ZESTRON

https://www.zestron.com/fileadmin/Filestorage/RESPONSIVE_Website/2-Products/TIs/EN/productinfo-zestron-coating-layer-test-en.PDF

-coatings, adding standardized methods for coating thickness measurements with a rapid detection of defects in closed or dense coatings : Tin Copper Nickel/ Nickel containing compounds Other less noble metals such as ferrite and alloys v04

IPC A-600 Certified IPC Specialist (CIS) Course at BEST Inc.

https://www.solder.net/training-courses/ipc-a-600-cis-training/

: PCB classifications PCB acceptance criteria Base material surface and subsurface conditions such as delamination and crazing Plated-through hole requirements for copper plating thickness, voids

Laser Machining of Coverlays/Coverfilm at BEST Inc.

https://www.solder.net/services/coverlay/

. The required component feature openings are mechanically created using drilling, routing, or laser cutting, Typical coverlay thickness is 0.001" polyimide with 0.001" of adhesive. And then either 0.0005 . After the coverlay has been laminated a laser sciving process (see below) can be used to remove the coverlay to expose underlying circuitry or pads without any damage to the copper

Multiple Sets of Blades V-cut PCB Cutting Machine ML-900 - QYSMT

https://www.qy-smt.com/product-item/multiple-sets-of-blades-v-cut-pcb-cutting-machine-ml-900/

×420mm Working Voltage 220V Working Pressure 0.4-0.6Mpa Power 800W Shear Length 0-unlimited Shear Width 8-230mm Shear Thickness 0.2-5mm Shear Speed 80, 120, 200, 400mm/second Blade Size 356×45 ×6mm Height of component ≦12.5mm Distance between component and V-cut ≧3mm Advantage Application Range : Separate precise SMD thin board, aluminum PCB, copper PCB, RF4, fiberglass PCB and T5T8 light at 0.1mm, which can quickly complete the required width. The speed of the conveyor belt is adjustable; The tool is specially made, the thickness of the blade

http://alpha1technologies.com/wp-content/uploads/2018/09/Axial-A30D-AS-IN.pdf

Component Span 5mm ~ 22mm 5mm ~ 22mm Minimum Board Size 50mm x 50mm 50mm x 50mm Maximum Board Size 450mm x 450mm 320mm x 285mm, 400mm x 285mm Option Process Height N/A 900mm Board Thickness 0.79-2.36mm 0.79 style taped components Jumper Wire (Optional) Independent Module: Dia 0.5 – 0.7mm Tin Plated Copper Wire Independent Module: Dia 0.5 – 0.7mm Tin Plated Copper Wire Cut

Metallization Furnaces | Solar Cell Metallization | BTU

https://www.btu.com/products/solar-cell-manufacturing-equipment/metallization-furnaces/

Dryers Pusher Walking Beam Applications Direct Bond Copper Brazing Sintered Metals LED Thick Film Advanced Batteries Solar Diffusion Meridian Technologies Custom Furnaces Controlled Atmosphere Furnaces Fast Fire Dryers Pusher Walking Beam Applications Direct Bond Copper Brazing Sintered Metals LED Thick Film Advanced Batteries Solar Diffusion Meridian . Uptime, reliability, and Cost of Ownership are also becoming increasingly important. In the meantime, cell producers strive to reduce wafer thickness for higher material efficiency, which will pose more stringent requirements on next generation firing furnace

Metallization Furnaces | Solar Cell Metallization | BTU

https://www.btu.com/solar-cell-manufacturing-equipment/metallization-furnaces/

Atmosphere Furnaces Fast Fire Dryers Pusher Walking Beam Applications Direct Bond Copper Brazing Sintered Metals LED Thick Film Advanced Batteries Solar Diffusion Meridian . Uptime, reliability, and Cost of Ownership are also becoming increasingly important. In the meantime, cell producers strive to reduce wafer thickness for higher material efficiency, which will pose more stringent requirements on next generation firing furnace

Why choose the ASCEN PCB separator ASC-620 pcb cutting equipment-PCB magazine loader,PCB loader,PCB

https://www.ascen.ltd/Blog/Solutio/493.html

maximum 4mm thickness PCB panel without the bend and twist with high durability and long life time,Normally, this ASCEN PCB separator can keep use more than 5 years without calibration from .2.5mm thickness aluminum PCB board in a good state, you can check the video in the following,   If you as the LED light manufacturer, you should understand the aluminum PCB board with a big tenacity, if the aluminum PCB board more and more thick,and the PCB board tenacity bigger and bigger for multi kinds of PCB board.   Please check the PCB separator cutting the FR4/ Aluminum/ copper material as the following operation video .  6, This PCB separator can cut off the 3mm thickness Aluminum bare board without the V-cut, It most of time use for the special cutting use in the PCB assembly processing

https://www.ascen.ltd/ASCEN-smt-conveyor-list-0.pdf

)Max length of PCB: unlimited 4) Material of PCB: LED aluminium ,LED copper ,FR4, 5)Speed: 80~400mm/s 6)Thickness: 0.2-3.0mm 7)Voltage:220V/50HZ,40W (110V/60Hz 40W) 700N series high-precision import spare blade : L1040*W400*H430 mm 2)Max length of PCB: 350mm 3) Material of PCB: LED aluminium ,LED copper ,FR4, 4)Speed: 300,500mm/s 5)Thickness: 0.2-2.5mm 6)Voltage:220V/50HZ,40W (110V/60Hz 40W) 7)Packing Weight: 62/74kg 8)508 model packing weight ) Standard SMEMA Port,with automatic cutting function and manually cutting mode (online versions) 5) Max length of PCB: unlimited 6) Thickness of plate: 0.3-3.0mm 7) Speed: 300~500mm/second 8) Blade material: import high precision steel with self-locking function 9 *80Hmm (1.2M platform) , 2400L*506W*80Hmm (2.4M platform) 3)Max length of PCB: unlimited 4) Material of PCB: LED aluminium ,FR4, CEM-1,fiberglass 5)Speed: 80~400mm/s 6)Thickness: 0.2-3.0mm 7)Voltage:220V/50HZ,40W (110V/60Hz 40W : 620 model 1) Max length of PCB: 355mm 2) Thickness of plate: 0.3-3.5mm 3) Speed: 300~500mm/second 4) Blade material: import Japanese high precision steel 5

Microsoft Word - 825HF_TDS_c

http://qualitek.com/wp-content/uploads/2017/06/p825hf_tds.pdf

. DSP 825HF offers enhanced features such as enhanced shelf life, room temperature stable at 6 months. It provides an x-treme fluxing activity level with excellent wetting on copper OSP-coatings to minimize and eliminate Voids Suitable with air or nitrogen atmosphere Complies with RoHS Directive 2011/65/EC Technical Data Specification Test Method Flux Classification ROL0 JSTD-004 Copper Mirror No removal of copper film IPC-TM-650 2.3.32 Corrosion Pass IPC-TM-650 2.6.15 SIR JSTD-004 2.01 x 10 10 ohms IPC-TM-650 2.6.3.3 Bellcore (Telecordia) 5.25 x 10 11 ohms Bellcore GR-78-CORE . DSP 825HF has been used successfully with 6 mil, 5 mil, and 4 mil foil thickness with excellent paste release. Squeegee Blades: Metal (stainless steel) squeegee blades angled from 45-60o give the best print definition . density, thickness, etc.) determine the actual reflow profile. Preheat Zone- The preheat zone, is also referred to as the ramp zone, and is used to elevate the temperature of the PCB to the desired soak temperature

Microsoft Word - 825HF_TDS_c

https://qualitek.com/wp-content/uploads/2017/06/p825hf_tds.pdf

. DSP 825HF offers enhanced features such as enhanced shelf life, room temperature stable at 6 months. It provides an x-treme fluxing activity level with excellent wetting on copper OSP-coatings to minimize and eliminate Voids Suitable with air or nitrogen atmosphere Complies with RoHS Directive 2011/65/EC Technical Data Specification Test Method Flux Classification ROL0 JSTD-004 Copper Mirror No removal of copper film IPC-TM-650 2.3.32 Corrosion Pass IPC-TM-650 2.6.15 SIR JSTD-004 2.01 x 10 10 ohms IPC-TM-650 2.6.3.3 Bellcore (Telecordia) 5.25 x 10 11 ohms Bellcore GR-78-CORE . DSP 825HF has been used successfully with 6 mil, 5 mil, and 4 mil foil thickness with excellent paste release. Squeegee Blades: Metal (stainless steel) squeegee blades angled from 45-60o give the best print definition . density, thickness, etc.) determine the actual reflow profile. Preheat Zone- The preheat zone, is also referred to as the ramp zone, and is used to elevate the temperature of the PCB to the desired soak temperature

SMT PCB Assembly - Online PCB Quote - Full feature custom PCB prototype service at low cost -PCBWay

https://www.pcbway.com/quotesmt.aspx

@pcbway.com Printed Circuit Boards PCB Prototype Aluminum PCB Rigid-Flex PCBs Metal core PCBs Flexible PCBs High Frequency PCBs High-TG PCBs Thick-Copper PCBs HDI PCB LED PCB SMD-Stencils Laser Stencil PCB : 1 Layer 2 Layers 4 Layers 6 Layers 8 Layers 10 Layers 12 Layers 14 Layers Copper layer: -- Top layer Bottom layer None Soldermask : Metal core in the middle      metal base on the bottom side FR4-TG: TG 130-140 TG 150-160 TG 170-180 Thickness: 0.4 0.6 0.8 1.0 1.2 1.6 2.0 2.4 * Unit: mm Min Track/Spacing : Tenting vias Plugged vias Vias not covered *For Gerber files, this choice is useless.It will be made according to files as default. Finished Copper: 1 oz Cu 2 oz Cu 3 oz Cu 4 oz Cu Inner Copper . Peelable Soldermask: None Top side Bottom side UL Marking:     None Yes - add to top silkscreen Yes - add to bottom silkscreen Yes - add to top soldermask Yes - add to bottom soldermask Yes - add to top copper Yes - add to bottom copper Yes - as PCBWay default

SMT PCB Assembly - Online PCB Quote - Full feature custom PCB prototype service at low cost -PCBWay

https://www.pcbway.com/quotesmt.aspx?f=fb

@pcbway.com Printed Circuit Boards PCB Prototype Aluminum PCB Rigid-Flex PCBs Metal core PCBs Flexible PCBs High Frequency PCBs High-TG PCBs Thick-Copper PCBs HDI PCB LED PCB SMD-Stencils Laser Stencil PCB : 1 Layer 2 Layers 4 Layers 6 Layers 8 Layers 10 Layers 12 Layers 14 Layers Copper layer: -- Top layer Bottom layer None Soldermask : Metal core in the middle      metal base on the bottom side FR4-TG: TG 130-140 TG 150-160 TG 170-180 Thickness: 0.4 0.6 0.8 1.0 1.2 1.6 2.0 2.4 * Unit: mm Min Track/Spacing : Tenting vias Plugged vias Vias not covered *For Gerber files, this choice is useless.It will be made according to files as default. Finished Copper: 1 oz Cu 2 oz Cu 3 oz Cu 4 oz Cu Inner Copper . Peelable Soldermask: None Top side Bottom side UL Marking:     None Yes - add to top silkscreen Yes - add to bottom silkscreen Yes - add to top soldermask Yes - add to bottom soldermask Yes - add to top copper Yes - add to bottom copper Yes - as PCBWay default

oven sn Fan

http://www.hellerindustries.com/search.php?zoom_query=oven+sn+Fan&zoom_page=24&zoom_per_page=10&zoom_and=0&zoom_sort=2

. Procured test board with bare copper pads protected with OSP. (Future testing to be run with HASL Lead Free Pads) Tested 2 pastes: 96.5% Sn /3.5% Ag with RMA flux melt point 221 C . Tin Silver Copper Antimony With .5% Antimony Cold temperature stability is enhanced Reduced Copper ... 5 Jul 2016   -   URL: http://www.hellerindustries.com/leadfree.pdf pan_APEX06 ... temperature of 230 C is necessary to achieve acceptable solder joints . The maximum temperature, on the other hand, depends on the board size, board thickness, component configuration, material thermal mass, oven capability, and etc

oven sn Fan

http://www.hellerindustries.com/search.php?zoom_query=oven+sn+Fan&zoom_page=3&zoom_per_page=10&zoom_and=0&zoom_sort=1

. The maximum temperature, on the other hand, depends on the board size, board thickness, component configuration, material thermal mass, oven capability, and etc . Procured test board with bare copper pads protected with OSP. (Future testing to be run with HASL Lead Free Pads) Tested 2 pastes: 96.5% Sn /3.5% Ag with RMA flux melt point 221 C . Tin Silver Copper Antimony With .5% Antimony Cold temperature stability is enhanced Reduced Copper ... 5 Jul 2016   -   URL: http://www.hellerindustries.com/leadfree.pdf nitrogencontrol.pdf ... degree of process control required to produce consistent, high-quality output

Microsoft Word - pan_APEX06.doc

http://www.hellerindustries.com.cn/pan_APEX06.pdf

. Solder paste needs adequate reflow temperature to melt, wet, and interact with the copper pad or other board metallization and component metallization to form the solder joint ). For SnAgCu reflow soldering, a commonly accepted minimum peak temperature of 230°C is necessary to achieve acceptable solder joints. The maximum temperature, on the other hand, depends on the board size, board thickness, component configuration, material thermal mass, oven capability, and etc . The intermetallic layer thickness is another factor that would impact solder joint strength. The intermetallic layer is a critical part of a solder joint because it facilitates bonding between the solder and the substrate . It is a single layer board with the board thickness of 62 mils (1.57 mm) and the board size of 3.875 x 5.375 inch2. The board material is FR-4. Figure1

Aluminum Finishing

https://www.clariant.com/aluminumfinishing

. Combinations with Sanodure® Fast Bronze L enable duplication of the entire range of gold colors from brassy to copper-like tones. more Sanodure® Fiery Red ML Sanodure produces shades ranging from brass to deep orange depending upon concentration and coating thickness. It is also useful for jetting various black dyes. more Sanodure® Violet CLW Sanodure Violet CLW is a quick-striking violet dye suitable for many novelty exterior and interior applications, and is effectively used for shading. more Sanodye® Brown R Sanodye® Brown R is useful for the production of oxidized copper and reddish brown shades. more Sanodye® Golden Orange RLW Sanodye® Golden Orange RLW produces shades ranging from brass to deep orange depending upon concentration and coating thickness. It may be shaded with Sanodye® Red GLW to produce a variety of gold colors. more Sanodye® Orange 2B Sanodye® Orange 2B produces a bright yellow-orange color

Aluminiumveredelung

https://www.clariant.com/de/Business-Units/Pigments/Special-Applications/Aluminium-Finishing

copper and reddish brown shades. Mehr Sanodye® Golden Orange RLW Sanodye® Golden Orange RLW produces shades ranging from brass to deep orange depending upon concentration and coating thickness. It may be shaded with Sanodye® Red GLW to produce a variety of gold colors from brassy to copper-like tones. Mehr Sanodure® Fiery Red ML Sanodure® Fiery Red ML is a homogeneous, water soluble dyestuff for the adsorptive dyeing of anodized aluminum. Only recommended for interior use. Mehr Sanodure® Green LWN Sanodure of anodized aluminum. Mehr Sanodure® Orange RL Sanodure® Orange RL produces shades ranging from brass to deep orange depending upon concentration and coating thickness. It is also useful for jetting various black dyes. Mehr Sanodure® Violet CLW Sanodure Violet

David Haskell, Author at Kyzen: Eco-Friendly Cleaning Products, Industrial Cleaning Solutions | Page

https://www.kyzen.com/author/dhaskell/page/19/

. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes and to develop a quantitative method for measuring nano-coating thickness remaining on the stencil surface. Co . M6310 contains no amines and is used extensively for brass screw machine parts. The aqueous chemistry contains corrosion inhibitors for aluminum, brass or other copper alloys. Additionally, M6310 is an excellent choice for tungsten carbide, die cast

David Haskell, Author at Kyzen: Eco-Friendly Cleaning Products, Industrial Cleaning Solutions | Page

https://www.kyzen.com/author/dhaskell/page/19/?option=com_content&task=view&id=146&Itemid=155

. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes and to develop a quantitative method for measuring nano-coating thickness remaining on the stencil surface. Co . M6310 contains no amines and is used extensively for brass screw machine parts. The aqueous chemistry contains corrosion inhibitors for aluminum, brass or other copper alloys. Additionally, M6310 is an excellent choice for tungsten carbide, die cast

IPC TM-650 Test Methods Manual | IPC

http://ipc.org/test-methods.aspx

2.2.12A Thickness of Copper by Weight - 3/76 TM 2.2.12.1 Overall Thickness and Profile Factor of Copper Foils Treated and Untreated - 9/87 TM 2.2.12.2 Weight and Thickness of Copper Foils with Releasable Carriers - 7/89 TM 2.2.12.3 Weight and Thickness Determination of Copper Foils With Etchable Carriers - 7/89 TM 2.1.3A Plated-Through Hole Structure Evaluation - 8/76 TM 2.1.5A Surface Examination, Unclad and Metal-Clad Material - 12/82 TM 2.1.6B Thickness of Glass Fabric - 12/94 TM 2.2.13.1A Thickness, Plating in Holes, Microhm Method - 1/83 TM 2.2.14 Solder Powder Particle Size Distribution - Screen Method for Types 1-4 - 1/95 TM ) - 2/01 TM 2.2.18 Determination of Thickness of Laminates by Mechanical Measurement - 12/94 TM 2.2.18.1 Determination of Thickness of Metallic Clad Laminates, Cross-sectional - 12/94 TM

Status of Standardization | IPC

http://ipc.org/Status.aspx

2.3.32E Flux Induced Corrosion (Copper Mirror Method) TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method TM 2.3.35.1B Fluorides By Spot Test, Fluxes-Qualitative TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning TM 2.3.44 August 2015 Determination of Thickness and Phosphorus content in Electroless Nickel (EN) Layers by X-Ray Fluorescence (XRF) Spectrometry SECTION 2.4 - Mechanical Test Methods TM 2.4.34A Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable

Technical Sessions | SMTA International

http://smta.org/smtai/tech.cfm

. This session will address both PoP and TSV methods and, in addition, will look into the reliability performance of new interconnect materials like copper wire bonds. High-Volume-Manufacturing (HVM) of BVA Enabled Advanced Package-on-Package (PoP) Rajesh Katkar Arkalgud, Invensas Corporation Corrosion and Contaminant Diffusion Multi-Physics Model for Copper-Aluminum Wirebonds in High Temperature High Humidity Environments Pradeep Lall, Ph.D. and Yihua Luo, Auburn University; Luu Nguyen, Ph.D., Texas Instruments . Solder-Joint Reliability of 0.8mm BGA Packages for Automotive Applications Burton Carpenter, Freescale Semiconductor Inc. and Thomas Koschmieder, Cirrus Logic, Inc. Board, Package and Die Thickness Effects Under Thermal Cycling Conditions Jean-Paul Clech Corporation Impact of Layer Thickness of QFN Mounted PCB's During Drop Testing Sayalee Sabne, M.S., Anik Mahmood, M. S., A.R. Nazmus Sakib, Ph.D., and Dereje Agonafer, University of Texas at Arlington; Alok Lohia, Texas Instruments Incorporated Thermal and solder alloy combination, the impact of copper roughness on surface finish and the effect of P content on the solder and wire bond reliability. Influence of Surface Finishes and Solder Alloys on Solder Ball Joint Reliability Yoshinori Ejiri, Takaaki Noudou

Workshops | SMTA International

http://smta.org/smtai/workshops.cfm

as well as direct gold on copper. Deposit description, thickness requirements, method of manufacturing, shelf life, application, limitations and relative cost will be covered in detail, from design thru assembly. A complete update on IPC Specifications . Bare die      ii. Interposer     iii. Molded with TMV     iv. Package considerations Design   • Package constraints and considerations     i. warpage     ii. thermal     iii. electrical constraints     iv. Total thickness   • Substrate design rules will be presented. Topics Covered Electroless Nickel/Immersion Gold( ENIG) Electroless Gold Electroless Nickel Electroless palladium/flash Gold (ENEPIG) Immersion Gold on Copper Electroless Palladium on Copper Organic Solderability Preservaties Immersion Silver . Topics Covered Stencil Verification   • SPI verification   • Test coupons   • SEM images   • Cleaning before using Stencil Troubleshooting   • Physical damage   • Foil thickness   • Aperture size   • Aperture location   • Impact on AR & TE   • Cut Quality

PCD Pump Series User Guide

http://www.gpd-global.com/co_website/pdf/doc/PCD-Pump-User-Guide-22293078M.pdf

voltage 600V. Copper 22AWG. 6 cores of TPE-E. Black jacket of FHF, PUR. Connecto * Reference medium approx. 1.000 mPas at 20 ° C. Maximum dispensing pressure and self-sealing decrease with decreasing viscosity and increase with increasing viscosity Cable flexibility High flex cable; flex cycles 5 million minimum. Bending radius -min: 5 x d, Cable features Max voltage 600V. Copper 22AWG. 6 cores of TPE-E. Black jacket of FHF, PUR. Co * Reference medium approx. 1.000 mPas at 20 ° C. ** Maximum : 250 mm (10”), extension cable available Cable flexibility High flex cable; flex cycles 5 million minimum. Bending radius -min: 5 x d, opt: 10 x d Cable features Max voltage 600V. Copper 22AWG. 6 cores of TPE-E. Black jacket of FHF, PUR. Connector : 250 mm (10”), extension cable available Cable flexibility High flex cable; flex cycles 5 million minimum. Bending radius -min: 5 x d, opt: 10 x d Cable features Max voltage 600V. Copper 22AWG. 6 cores of TPE-E. Black jacket of FHF, PUR. Connector

AX-301 501 front.indd

http://islandsmt.com/wp-content/uploads/2017/05/AX301-and-AX501-Brochure.pdf

• Programmable placement force available from 1.5 to 8 N • Automatic correction for component thickness variation • Automatic correction for board height variation (e.g warpage ) • Placement quality is assured by component sensing from pick to place Board transport • Features automated width and thickness adjustment of edge clamped boards . In between the run-in and run-out section is the working area of the machine where the compo- nents are placed on the board. The automated transport unit adjusts to the correct width and thickness of the board and all boards in the working area are clamped on the side • Hot Air Solder Leverled (HASL) • Bare copper with Organic Surface Protectant (OSP) • Electroless Ni / Immersion AU Minimum board dimensions (L x W =800mm optional *2 475 x 390mm, 475 x 457mm optional Y/X ratio < 2.5 < 2.5 Board thickness 0.3mm - 6mm Optional other transport systems are available like fl exfoil or 10mm for carriers

http://islandsmt.com/wp-content/uploads/2017/05/Opal-XII-Specification-Book.pdf

fixation Max: 460 x 440mm (18" x 17.2") Special applications upon request PCB Weight: Max. 1.2 Kg Without components Max. 2.0 Kg With components PCB Thickness: Min: 0.4mm (0.015") Max: 4.0mm (0.15") Special applications upon request Non-mountable area: Board top side: 3mm from rear side board edge (0.12") Component height restrictions 0mm from front side board edge apply in the 10mm (0.40”) area from front side edge depending on board thickness 4mm around reference holes (0.16") (locate pins) Flat edge : Phenolic/FR4/Composite Materials Ceramic PCB’s requires special conveyor section (optional) PCB positioning: Locate pin fixation Adjustable second pin Z servo controlled push up system Software controlled by PCB thickness Push up pins Adjustable positions controlled )with 12 push up pins, for PCB support. PCB thickness is included in the PCB data. • Substopper, allowing a second PCB to enter the machine for reducing transport time. • Exit Substopper, allowing a new PCB to enter the work area of the machine Compensation for: Non-linear stretch and shrink (with 3 or 4 fiducials) Type of compensation: PCB , Block, Local Fiducial size: Max. 3.0mm (0.12") Min. 0.8mm (0.03") Fiducial material: Copper Gold Lead-tin Fiducial clearance area: 2 x Fiducial size PCB warpage

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