Electronics Forum | Wed Jun 09 12:20:26 EDT 1999 | Gang Pan
I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. There is anybody has experience on metal-based PCB reflow process? I guess pre
Electronics Forum | Sat Jul 25 08:47:25 EDT 2009 | davef
Both "moisture content of bare board" and the "thickness of the copper plating in the PTH" are related to each other. As you heat the solder connection, moisture in the board boils and out-gasses through the solder connection. Plating with the proper
Electronics Forum | Tue Mar 14 13:42:45 EST 2006 | patrickbruneel
If the OSP boards have gone through double reflow I assume that you use an aggressive (halide) flux for wave soldering. SAC 305 is known (search the archives) to dissolve copper faster than other lead-free alloys. This together with an aggressive flu
Electronics Forum | Thu Mar 09 16:33:30 EST 2006 | russ
Is there a way that you could plot the data points of your profile into excel and post somewhere? Or can you give us some data on what your profile looks like? What exactly does this board look like? thickness, size, copper weight?
Electronics Forum | Wed Sep 03 16:15:30 EDT 2008 | blnorman
Elemental is by SEM/EDX. The brown coloration does resemble the 3 micron photo. Again, if I'm picking up copper (our Ag plating thickness requirements are 0.05 micron to 0.12 micron following IPC 4553), maybe we do have a porous silver plating.
Electronics Forum | Thu Aug 24 15:54:13 EDT 2006 | davef
It depends. What is: * Storage environment and period * Board laminate, epoxy, and copper thickness of PTH * Down stream process * Etc FR4 0.062" thick boards absorb between 0.08 to 0.1%Wt of moisture within a 24 hour period, and 0.2 to 0.23%Wt in
Electronics Forum | Thu May 29 14:27:04 EDT 2003 | larryk
This flex is .001" Kapton polyimide. The flex portion of this rigid flex consists of 3 layers of 1 oz copper with 5 layers of Kapton. Part of the flex is sandwiched in standard FR4 with two layer of copper on each side for a finished thickness of .
Electronics Forum | Sat Sep 20 11:44:39 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - PCB copper finisch ? (OSP,HASL, ENIG, etc) - v
Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F
Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier
Electronics Forum | Fri Jul 24 23:20:11 EDT 2009 | umar
Hi Dave, Thanks on your feedback, May I know the how's the contributing of Moisture content of bare board and the Thickness of the copper plating in the PTH to the solder ball and solder splash during hand soldering process ?