Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
Electronics Forum | Wed Sep 18 14:12:40 EDT 2013 | pjchonis
Hello Bachman. SAC305 is the most common lead-free solder alloy, not only for wave soldering but also selective. Most of our selective customers (especially automotive) are using SAC305. What is more important than the alloy to consider is the flux
Electronics Forum | Tue Aug 21 08:34:03 EDT 2007 | rgduval
We have the same problems with cut/tape parts. But, we specialize in short-run prototypes, so I don't have much of a choice but to deal with it, and find a way to make it as easy as possible. We just demo'd a splice tool from Sierra Electronics (ww
Electronics Forum | Fri Nov 08 14:05:36 EST 2002 | slthomas
I have....they lay down copper strips every 10 feet or so , attached to house ground, then glue down the carpet. The glue is filled with carbon filaments, as is the carpet itself.
Electronics Forum | Tue Jan 16 07:07:17 EST 2007 | tk380514
Answers: The component does take solder, no problem We get a full barrel fill with an empty PCB but only on one of the holes, the other hole has so much copper around it. The flux reached the top of the PCB when I tested the empty PCB. The IPC-A-610
Electronics Forum | Sat Nov 03 10:57:27 EDT 2012 | davef
EricR: Regarding "*** By the way, since we have used the Tin-Silver-Copper lead free solder there has been a strange liquid type chemical leek from the oven exhausted pipes." ... I don't know anything about your process, but the first thing I'd inve
Electronics Forum | Fri Apr 27 08:44:08 EDT 2007 | Brett
For those of you who use via holes as test points, and the via holes must be filled at the wave, is it necessary to have a "dome" on every single test point, or is it sufficient to have the via "filled" with solder? The ICT preson here insists that
Electronics Forum | Fri Apr 27 10:55:54 EDT 2007 | Brett
Pete, is there a probe-style that will accomodate a via that's filled, but a little concave (inward) fillet? The ICT personnel complains about this scenario too. I'm not an ICT person, but I do know that there are pogo pins that have a crown (for t
Electronics Forum | Mon Mar 02 23:48:22 EST 2015 | vb7007
Hi We are using Universal carrier for a 2 sided PCB, where the bottom side goes for hand solder the switches after wave. Our issue is, we are getting micro solder balls all over PCB bottom after wave, whereas we got numerous vias, which also turns
Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002
This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre
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