Electronics Forum: copper and plated and vias (Page 1 of 4)

cap size and copper thickness vs part size questions

Electronics Forum | Mon Nov 07 12:25:32 EST 2005 | Rob

Hi CW, Larger chip caps can be susceptable to cracking, but mainly this is due to handling - flexing of boards is the main culprit (the part being mechanically joined at both ends to the board). PCB's usually flex easiest along one axis, and larger

distance from the edge Non-plated mounting hole and with copper pads ?

Electronics Forum | Fri Oct 26 05:03:17 EDT 2018 | farouk225

Hi everybody, I have a question about the minimum distance to leave beteween a non non-plated mounting hole with copper pads and the edge of the PCB. Is there any formula or rule to apply ? For example for a hole of diamater equals to 5.6mm which

distance from the edge Non-plated mounting hole and with copper pads ?

Electronics Forum | Fri Oct 26 12:29:22 EDT 2018 | davef

I'm not aware of a standard requirement. One screw hole diameter seems to used commonly.

distance from the edge Non-plated mounting hole and with copper pads ?

Electronics Forum | Fri Oct 26 13:16:41 EDT 2018 | slthomas

Is there any chance that something like a riv-nut might be used for mounting purposes or is it just a screw hole?

Solder mask and fine pitch devices

Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002

This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre

Silver Epoxy and CEM3

Electronics Forum | Wed Aug 26 12:02:23 EDT 1998 | Steve Joy

Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? What are the limitations? Thanks, Steve

COB and Plating

Electronics Forum | Tue Oct 07 12:35:10 EDT 2008 | andy_pal

Hi All, I am using COB on my DOUBLE SIDED PCB. lastly we used Eletrolytic Ni / Flash Gold Plating. Our Boards vias Failed the UL corrosion Test. we did some cross-section analysis and found 10.75 �m of Nickel and 0.022 um of Gold and as the Process

Re: Silver Epoxy and CEM3

Electronics Forum | Fri Aug 28 23:32:39 EDT 1998 | Pete Sorenson

| Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? | What are the limitations? | Thanks, | Steve I have used silver epoxy extensively for conductive bonding applic

Re: Silver Epoxy and CEM3

Electronics Forum | Thu Aug 27 17:40:11 EDT 1998 | Earl Moon

| Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? | What are the limitations? | Thanks, | Steve Steve, Hello again. Hope you guys (Intel) aren't going to do that

qfp and soic joint Problem

Electronics Forum | Tue Apr 11 10:30:46 EDT 2000 | Jeremy Smith

I am having a problem with some joints on a 100 pin pqfp and few different soics on one particular board. When viewed a 8x with a "Mantis" inspection scope the joints look as though they wetted to the ic leg but when probed the leg will pop loose.

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