Electronics Forum: copper foil reflow (Page 1 of 50)

Migration of copper during reflow process

Electronics Forum | Tue Mar 18 17:23:40 EDT 2008 | dkntb

Any member in here has experienced of copper migration from BGA's substrate to PWB during eutectic soldering reflow process, which resulted in brittle solder joints??? We have one customer notified us that our PBGA with DSOP substrate having copper m

Lead free tin copper only

Electronics Forum | Sun Feb 05 08:41:15 EST 2006 | Cmiller

Are you refering to reflow soldering or wave soldering? Brian, do you have any data to support that SAC305 is more reliable than Tin-Copper-Nickel? NEMI reccomended SAC type alloys for reflow and Tin-Copper for wave. See: http://circuitsassembly.

Lead free tin copper only

Electronics Forum | Sun Feb 05 09:29:12 EST 2006 | Cmiller

Look at: http://thor.inemi.org/webdownload/newsroom/Presentations/09.pdf Page 47 shows both alloys to be similar in reliability although its a little troublesome that the particular defects are not isolated as I feel there is a big difference betwee

Soldering an 18 layer 2oz. copper board

Electronics Forum | Fri Oct 18 16:24:05 EDT 2002 | russ

Big BIG BIGG wave with a lot of preheat capability both top and bottom. You may need to exceed the standard "100 C" top side preheat to 120C or so (be aware of any topside SMT going into reflow over the wave). A spray fluxer with very fine atomizati

cap size and copper thickness vs part size questions

Electronics Forum | Mon Nov 07 11:26:23 EST 2005 | CW

How large of chip capacitor can we use reliably? I��ve heard they tend to crack. I��ve also heard if you pre heat the larger chip caps (1812 and above) before vapor phase reflow, they won��t crack. If I use 2 mil copper for a power supply board, a

cap size and copper thickness vs part size questions

Electronics Forum | Tue Nov 08 05:00:23 EST 2005 | rlackey

Hi CW, Regarding orientation, yes, your diagram is right - see the following link for confirmation. http://search.murata.co.jp/Ceramy/image/img/A18X/C2EB3C.PDF Regarding information on bending strength you want to talk to your local Murata office

cap size and copper thickness vs part size questions

Electronics Forum | Mon Nov 07 12:25:32 EST 2005 | Rob

Hi CW, Larger chip caps can be susceptable to cracking, but mainly this is due to handling - flexing of boards is the main culprit (the part being mechanically joined at both ends to the board). PCB's usually flex easiest along one axis, and larger

Re: Where can I purchase a PCB with a bare copper grid for solder flux evaluations.

Electronics Forum | Mon Aug 30 16:10:10 EDT 1999 | Dave F

I have looked through the IPC web page and surfed to frustration. Can somebody give me a lead? Brian: We don't use an etched board. We use a special stencil, described below and print on bare copper laminate. 3 Solder Wetting Test. Recogniz

Losing parts in reflow

Electronics Forum | Wed Jun 13 14:48:48 EDT 2007 | rgduval

Is there a sort of standard method to prevent part loss in reflow? I've had a couple of situations come up recently where we've lost some parts during second-side processing. We're running an Heller 1800, with a mesh belt. Most items process fine,

BGA reflow on bottomside

Electronics Forum | Tue Nov 20 09:50:07 EST 2007 | rgduval

Only on the bottom side? Run that side first . We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend

  1 2 3 4 5 6 7 8 9 10 Next

copper foil reflow searches for Companies, Equipment, Machines, Suppliers & Information

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
MSD Dry Cabinets

Easily dispense fine pitch components with ±25µm positioning accuracy.
Affordable, Scalable Parylene

Real Time Process Control BREAKTHROUGH for Dispensing Industry.
SMT & Related Equipment - Delta Tau Data Systems Inc.

Want to know where to find the best AOI system? - Read testimonials.
Electronic Solutions R3

Thermal Transfer Materials.