Electronics Forum: copper plating (Page 1 of 43)

beryllium copper

Electronics Forum | Tue Mar 14 16:26:45 EST 2006 | patrickbruneel

BeCu is not solderable without plating Cu, Sn, Ag, Ni etc. The solder joint will only be as strong as the bond strength of the solderable plating to the BeCu Pat

PWB plating

Electronics Forum | Wed Feb 03 06:35:14 EST 1999 | Teemu M�kiniemi

Hi! Does anyone know any roadmaps for board plating materials. Especially I'm interested in finishes, which are plated onto copper. Teemu M�kiniemi

Terminal plating

Electronics Forum | Wed Sep 01 08:27:38 EDT 2004 | davef

Zinc from the brass [Cu3Zn2] diffuses into the tin causing solderability problems. Just 0.001% of Zn in your solder can render it fit for the scrap heap. So, you need a barrier plate between the brass and the tin. Copper or nickel-plating is commonl

Terminal plating

Electronics Forum | Wed Sep 01 05:25:34 EDT 2004 | Martin

Hello, I am looking for some advice please about how to go about plating some brass pins for a new assembly. (which will be hand soldered) I have spoken to a couple of "experts" who seem to contradict themselves.. Firstly what should I be solderin

Verifying requested copper weight

Electronics Forum | Tue Apr 24 09:19:51 EDT 2018 | vetteboy86

Is there a preferred method among printed circuit board assembly for accurately and quickly verifying the copper weight of a printed circuit board? I would like a tool and process that our quality inspector could quickly use to verify upon receipt of

contamination on copper

Electronics Forum | Thu Apr 15 11:15:30 EDT 2004 | patrickbruneel

Pure (red) copper oxide is green, its not a residue its just oxidation. In your case water and heat will accelerate the oxidation process of unplated or unprotected pure copper. The best way to avoid this from happening is use a socket with tin or n

Re: copper land delamination

Electronics Forum | Mon Nov 15 21:35:50 EST 1999 | Dave F

Bob Bob: Fortunately, you found this before you built-up a lot of product. Some thoughs and other drivel: 1 Use IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical pad peel strength requirement for FR-4, 2 oz. copper is: 6 l

Plated hole to copper spacing

Electronics Forum | Wed Nov 23 08:43:48 EST 2022 | charles_nguyen

I am having problem with plated hole-copper spacing. I don't know if the gap between plated hole and copper can meet the capacity of PCB manufacturers. My board have 0.5oz copper weight on outer layer and distance of 0.177MM between plated hole and c

Connector leads plating

Electronics Forum | Tue Dec 10 10:26:56 EST 2002 | davef

Questions are: * What is the current plating on the connector that is over the "plating of the leads is Nickel (99.9% purity)"? * What are the temperatures and durations at those temperatures that you read on these connector leads? * What solder allo

Connector leads plating

Electronics Forum | Tue Dec 10 05:03:58 EST 2002 | praveen

We are having solder fillet finish issue. The solder looks like rough solder on the connector leads .The plating of the leads is Nickel (99.9% purity) and the PCB plating is imersion gold. I have tried fine tuning my reflow profiles an have used N2 i

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