Electronics Forum | Thu Jan 23 23:00:42 EST 2014 | davef
I agree with AFlex. Don't tin stranded wire that's assembled into a screw terminal block. I believe the reasoning has to do with avoiding stress on the wire metal caused by different expansion rates of the solder and the wire. BR davef
Electronics Forum | Wed Nov 02 01:24:07 EST 2005 | arnold
we are encountering a problem on our production. after dipping a copper wire AWG#30 to a leadfree solder the wire becom thinner and easily to break. does the leadfree soler has the capability to weaken the wire (lessen the diameter)after dipping to l
Electronics Forum | Wed Nov 02 21:58:17 EST 2005 | KEN
Copper wire will become thinner when dipped in tin/lead or lead free solder. The copper is disolved off of the bulk wire. This is one reason rework on solder pots must be restricted. Eventually, after repeated cycles you will have smaller and sma
Electronics Forum | Thu Nov 03 07:22:16 EST 2005 | davef
arnold: I did not say that Sn100 dissolved copper faster. The graph of dissolution rates [from the link above] shows that Sn100 dissolves copper slower than many of the other solders.
Electronics Forum | Wed Nov 02 03:35:09 EST 2005 | Slaine
I thought it was the tin content that leached the copper so presumed 100Sn would be more aggressive?
Electronics Forum | Thu Nov 03 04:31:21 EST 2005 | arnold
davef, how can you convince me that 100Sn dissolved copper much faster?
Electronics Forum | Thu Nov 03 13:35:46 EST 2005 | Amol
the copper forms intermetallics with tin to get Cu3Sn and Cu6Sn5. thus intermetallics formation consumes Cu and depends upon the cooling rate, faster the cooling rate, lesser the intermetallic formation