Electronics Forum: core materials (Page 1 of 6)

OA core solder stranded wires

Electronics Forum | Mon Jan 04 15:07:27 EST 1999 | Tracy Hille

I am looking for information regarding post wave soldering of stranded wires into a circuit board using OA core wire solder. We do a final pass thru the cleaner after the hand soldering but I'm concerned about any OA flux residue that may have wicke

Cleaning OA solder core residues with alcohol

Electronics Forum | Tue Aug 01 22:04:11 EDT 2006 | davef

Problems with IPA are: * IPA / material being 'cleaned' combination still needs to be removed from the board. * IPA and empty containers are a hazardous material by RCRA criteria (40CFR 261) * Flash point (~12*C TCC) of IPA is low enough that all ele

Re: OA core solder stranded wires

Electronics Forum | Tue Jan 05 18:07:53 EST 1999 | Dave F

I am looking for information regarding post wave soldering of stranded wires into a circuit board using OA core wire solder. We do a final pass thru the cleaner after the hand soldering but I'm concerned about any OA flux residue that may have wic

Copper Finishes versus Layer Thickness

Electronics Forum | Thu Jan 04 12:51:37 EST 2007 | Board House

Hi Chunks, Starting copper on outer layer with .0007 is 1/2 oz. copper foil. so if starting copper is .0007 and your Board house will plate an additional .0021 mils of copper. which will give you a finished copper weight of .0028 Mils or (2 oz.) Y

Re: Buried Capacitance In PWB

Electronics Forum | Wed Aug 18 16:15:04 EDT 1999 | Earl Moon

Hadco offers a technology of building in a "buried" capacitance layer (& other embedded passives) in organic PWBs (FR4 for example). see http://www.hadco.com/prod03.htm and a design manual is posted here: http://www.hadco.com/pdfs/bcguide.pdf I

cem3

Electronics Forum | Fri Oct 05 09:15:23 EDT 2001 | Ben Bierlein

It is a PCB material that has a woven glass / epoxy internal core and glass veil surface. It is in between the paper materials (FR1,FR2 and CEM1) and FR-4 as far as strength and cost. It is available in HiCTI material for high power applications.

Re: Heat Dissipation Problem

Electronics Forum | Wed Sep 01 14:31:22 EDT 1999 | Dave F

To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has any

Re: Heat Dissipation Problem

Electronics Forum | Thu Sep 02 04:26:02 EDT 1999 | Wolfgang Busko

To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has a

Re: Measling

Electronics Forum | Thu Oct 15 14:23:31 EDT 1998 | Earl Moon

I have a problem with measling on our PCB's. We saw it on our FR4 PCB's at final assembly yesterday. Is this a defect from the board vendor or something we did in our assembly process when building the PCA's (thru hole). Could the wave solder ma

Etchback

Electronics Forum | Wed Oct 19 07:44:33 EDT 2005 | davef

When a hole is drilled during board fabrication, it can transfer resin from the base material (eg, FR4 core or prepreg) to cover the exposed edge of conductive material in the wall of a drilled hole. This is called resin smear. Etchback is a control

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