Electronics Forum | Fri Apr 06 00:08:41 EDT 2007 | barney
What software level do you currently have on your machines? If you have UPS+ 6.2.x there is a huge improvement. In the SOIC/QFP or any leaded catagory you will find a check box under the vision tab called noise filter. Check this box and the software
Electronics Forum | Thu Aug 16 09:42:15 EDT 2007 | russ
This could be the reason for the mask defined pad. ERROR in docs! This happens a lot. I believe this to be case honestly, I would not use mask defined pads for these. If you get a registration shift in mask which is likely you will run into troub
Electronics Forum | Mon Aug 13 08:13:50 EDT 2007 | davef
Hi Bud We buy what you're selling, when you say, "I suspect ... coo planarity of the connector during soldering (bending like banana) and that is why first or last leg is not soldered." This component is probably acting like some BGA that curl at t
Electronics Forum | Thu Aug 16 20:03:10 EDT 2007 | sarason
There seems to be bugs in the way VIOS and UFOS formats are read by the software. It's OK on component postions but PCB Objects and Circuit Objects can't be read or written correctly for these formats. The Board Dimensions are synthesized by taking a
Electronics Forum | Wed Aug 22 09:53:06 EDT 2007 | slthomas
"The question is: should we be looking at the operator? the paste? or the setup?" Yes. ;) Those guys love to brag about their 4 corner height adjustment on those printers. The fact is it's a PITA and shouldn't be necessary in the first place. It's
Electronics Forum | Fri Jan 04 21:58:03 EST 2008 | mika
Hi everybody out there, A little interesting something for all of us of how to handle the cad-component orientation in regards to cad import into your SMT-machines S/W (Fuji Flexa, FujiCam, UIC, Siemens, Pana, Mydata or Whatever). We have struggle f
Electronics Forum | Fri Apr 11 06:22:04 EDT 2008 | andrzej
Hi Andrzej, > > We are using for BGA (0.8 pitch) > square apertures size 0.4 mm (rounded corners r = > t) and stencil thickness t=5 mils. So area > ration-_ w/4t=0.8 > > Regards Jan Hello Jan, I understand that you have the same pad dimensio
Electronics Forum | Mon Aug 11 09:59:40 EDT 2008 | John S.
Guys, We're seeing what looks like an issue where through hole solder joints from our ive solder process are cracking during the cooling phase of the soldering process. This was detected during thermal shock testing, and we have tracked it back to a
Electronics Forum | Mon Aug 25 08:26:33 EDT 2008 | scottp
We've gone through this a couple times. Once it was because the device was warping in reflow. We confirmed with shadow moire that the corners were lifting up. The supplier fixed some things in their molding process to reduce the warpage. Another
Electronics Forum | Wed Jan 14 13:38:38 EST 2009 | vleasher
I am attempting to identify a good epoxy to hold on larger parts on thru the reflow process for the opposite side. We currently dispense epoxy prior to second reflow on the corners of the component because the epoxy we use cures before reflow and doe
