Electronics Forum | Fri Sep 15 15:50:54 EDT 2006 | Steve
Good info, Russ. I'm glad we aren't the only ones that go to extra lengths to use up short strips of parts, both kitted and our own supplied parts. The tought part is making the call to throw out the left-overs since the operators generally don't kno
Electronics Forum | Thu Sep 28 09:19:05 EDT 2006 | realchunks
Apart from recommending a placement machine since I don�t know you product, part mix or tact time; I would just like to point out a few other things to consider when choosing a different placement machine. Feeders are a big thing. Mydatas are good
Electronics Forum | Thu Dec 07 18:41:27 EST 2006 | GS
RoHS, or better Lead Free is an EU Directive that has been pushed ahead and driven by opportunistic lobbies ( equipment, materials, componentes,logistics, analysis labs, consultants, etc). Over here, in Eurolandia, since 2001 (the smartest started
Electronics Forum | Tue Aug 21 08:34:03 EDT 2007 | rgduval
We have the same problems with cut/tape parts. But, we specialize in short-run prototypes, so I don't have much of a choice but to deal with it, and find a way to make it as easy as possible. We just demo'd a splice tool from Sierra Electronics (ww
Electronics Forum | Mon Jan 29 16:04:29 EST 2007 | BillW
Thanks Russ and John, To clarify defects when manufacturing a PCBA, I use (2) groups of defect categories, one for components and one for solder joints. These can be calculated separately or combined A component defect could be: Missing, Miss-alig
Electronics Forum | Tue Feb 12 19:11:37 EST 2008 | larryd
Determine what the likly product will be. Then match the capablity of the equipment to the market segment. Functional test is product specific. Several sticking points. Customers like to see an operating factory before placing orders. Big capital
Electronics Forum | Mon Feb 25 11:12:32 EST 2008 | hegemon
It sounds more as though you have a profiling problem primarily, however, if your placement is not square to the board, then you should get your machine setup correct first. After that you can get to the profiling. If the BGA is brought up to tempe
Electronics Forum | Thu Jun 19 21:39:31 EDT 2008 | mika
Hi, we used to have a RoHS package with uBGA 380 Solder ball's 0.8 mm pitch approx 15x15 mm, bump size is 0.4mm on a 0.33mm pad. Suddenly we need to use another vendor for various reasons. However, the new bump size is 0.45mm according to specs and t
Electronics Forum | Fri Jul 11 10:32:10 EDT 2008 | JH pbf
Got to agree with CK and Patrick. A very brief career history: 1992 Engineering Apprenticeship 1994 Job as a Temp, placing components in a local electronics firm 1996 Made perminant Process Tech through experience gained 1998 A year selling solder a
Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon
You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to
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