Electronics Forum | Wed Dec 20 14:52:38 EST 2000 | susan
For attribute data, the process capability is reflected by the process average nonconforming (e.g.p bar). Reference the automotive group's AIAG SPC Manual. Hope this helps, Susan
Electronics Forum | Wed Feb 07 20:57:31 EST 2001 | Kyle
What are you placing on this equipment? If you are placing flip chips, you need to have a glass plate test system to verify your machine is accurate and repeatable. If you purchase new equipment and plan to place flip chips or ultra fine pitch, it
Electronics Forum | Mon Apr 16 22:24:35 EDT 2001 | spchua
Hi; can any body provide the following advices: 1. What's cp and cpk 2. How to calcilate. 3. How to define sigma. 4. How it work. Please provide all these in detail; and thanks for the information provide.
Electronics Forum | Tue Mar 19 11:54:08 EST 2002 | davef
FORMULA OTHER THAN LxBxZ? - Paste is X% [X=~50] metal by volume. Your paste supplier knows the value of 'X'. HOW TO ACHIEVE A CONSTANT REFLOW PROCESS CAPABILITY? - Buy a capable oven, operate and calibrate it properly.
Electronics Forum | Wed Mar 20 19:58:59 EST 2002 | davef
You based the aperture size on LxBxH. Where did you get the LxBxH? Obviously the thickness of the stencil is kinda fixed. Who gave you the other numbers? Consider searching the fine SMTnet archives for background on aperture design.
Electronics Forum | Wed Apr 03 13:42:49 EST 2002 | Bob
Just one minor point to bear in mind, most stencils have tapered apertures. If you want to get really accurate volumes you will need to work put the volume based on the taper of the walls. Probably going to far but at least you can sound knowledgeab
Electronics Forum | Wed Apr 03 18:31:54 EST 2002 | davef
To date, much of this discussion has focused on determining the volume of solder paste. That is but one piece of the measurement of process capability. The other aspect that needs to be evaluated is: an assessment of the accuracy of the positioning
Electronics Forum | Thu Apr 04 03:20:59 EST 2002 | ianchan
Good points... Thanks everyone. ref back to Mr.Bob's/Dave's observation (not in order) on brick accuracy, position & placement, Stencil apperture geometrical opening, will feedback to my team to brain-storm further.
Electronics Forum | Thu Apr 04 09:22:35 EST 2002 | itempea
What are the normal control limits in the industry, for a well controlled process, using a 6 mils stencil? Should they be different according to the surface finish (higher UCL for ENIG, Im SN, etc, lower UCL for HASL)? Thanks, Ioan
Electronics Forum | Wed Aug 21 01:40:42 EDT 2002 | jkhiew
Hi all, Our management set target 50 ppm for overall process like printing,mounting & reflow soldering. Our m/c cpk for mounter is 1.0 & for printing is 1.33. So, pls comment !
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