Electronics Forum: cracked and 2010 (Page 1 of 21)

warped boards and cracked solder joints

Electronics Forum | Mon Oct 29 18:21:43 EST 2001 | slthomas

We recently have received a lot of warped (bowed and/or twisted behond IPC 600 specs.) bare boards (some our fabricator's fault, some ours by design) and I can't help but figure that long term reliability will suffer when building product with them.

warped boards and cracked solder joints

Electronics Forum | Tue Oct 30 10:54:37 EST 2001 | slthomas

Hey, Preacher, choir here. Unfortunately I didn't get to make the call here (hot boards, new product, same ol' same ol'), but I dam* well am looking for future (print) backup to assist in persuading the bottom line guys that it's cheaper to wait for

warped boards and cracked solder joints

Electronics Forum | Mon Oct 29 20:19:44 EST 2001 | davef

DON'T do it!!! The two problems you'll have are: 1 Poor manufacturing process control, resulting in weak solder connections. 2 Weak solder connections are stressed, when the board is straightened upon installation in the "box". There's several hits

ICT and specifying PCBA testing

Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway

Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps

BGA and Gold Boards

Electronics Forum | Fri Jun 19 09:45:21 EDT 1998 | Mike Cox

Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. Mike

Dye and Pry

Electronics Forum | Sat Mar 15 01:03:10 EDT 2008 | callckq

All, What if BGA solder crack do exist after the shock test? Its happen at the corner of the BGA. Base on your experience, what are the potential root causes? Thanks, Sean

No Clean and Underfill

Electronics Forum | Fri Mar 19 12:17:15 EDT 2010 | stepheniii

Be carefull if you go to no clean. Or be prepared from complaints from the test department regarding their ICT pins getting dirty.

Dye and Pry

Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq

Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the

No Clean and Underfill

Electronics Forum | Fri Mar 19 10:27:42 EDT 2010 | karlo

No clean pastes leave more flux residues. These can result in void formation and inhibtion of underfill curing. Selection of an underfill that is compatible with the flux residue is important. One company that has written about the effect of flux

GSM2 and FlexJet heads

Electronics Forum | Fri Mar 19 10:04:51 EDT 2010 | dilogic

Thanks for the explanation - it's hard to get any information from UIC when it comes to the older equipment, so I am stucked to this forum. Can you maybe give me a hint where to ask for such conversion kit?

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