Electronics Forum | Mon Dec 16 19:05:57 EST 2002 | davidduke
Steve , I agree with all the responses you have received. Randy Villeneuve is absolutly correct in all of his assesments and I would consider him an expert with the process , Gris is correct about adding a "heat sink" to the process complicating pr
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Sat Jul 26 07:31:14 EDT 2008 | bobwillis
We have created a new online free database on process defects at NPL which you can search. http://defectsdatabase.npl.co.uk There are many reasons for solder balling on wave and reflow and examples are provided. You could always use the database t
Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F
Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is
Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F
Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is
Electronics Forum | Thu Jun 27 21:28:42 EDT 2002 | davef
You're correct that the Ni/Pd termination seems to have something to do with you solder balling. It could be related to the interaction between your paste and the Pd. I assume these are really 'fines' rather than 'balls'. Things that come to mind a
Electronics Forum | Tue Jun 20 15:08:30 EDT 2017 | ranap121212
Hello I have the problem with selective soldering on the robot. Thin balls appear on the laminate. The tin sometimes shoots...? and then the balls are a few millimeters from the soldering point. I tried up or down with temperature, but it did not wor
Electronics Forum | Wed Mar 01 16:58:03 EST 2000 | Dave F
Robert: On your balls: Solder suppliers make several "standard balls" and can advise you. On your cleaner: Recycling water / direct to drain? Most batch cleaner suppliers can advise you on recycling and filtering systems to keep you out of troub
Electronics Forum | Wed Mar 01 16:58:03 EST 2000 | Dave F
Robert: On your balls: Solder suppliers make several "standard balls" and can advise you. On your cleaner: Recycling water / direct to drain? Most batch cleaner suppliers can advise you on recycling and filtering systems to keep you out of troub
