Electronics Forum: criteria (Page 46 of 55)

Re: Good Solder Joint Failures

Electronics Forum | Mon Feb 15 17:57:01 EST 1999 | Earl Moon

| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they

Re: Void in solder bump

Electronics Forum | Fri Jan 15 13:35:03 EST 1999 | Terry Burnette

| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat

Re: Pretty dirty pictures

Electronics Forum | Mon Sep 28 11:34:26 EDT 1998 | Steve Gregory

| Does anyone out there have any pictures (jpeg preferred) of solder paste prints - or know where some are available. It will be awhile before our 35mm camera for our 3D scope arrives and I need some for inspection criteria. I need the good, bad, and

Re: Pretty dirty pictures

Electronics Forum | Mon Sep 28 13:16:58 EDT 1998 | Earl Moon

| | | Does anyone out there have any pictures (jpeg preferred) of solder paste prints - or know where some are available. It will be awhile before our 35mm camera for our 3D scope arrives and I need some for inspection criteria. I need the good, bad

Re: Ball Grid Array (BGA)

Electronics Forum | Fri Sep 11 09:45:39 EDT 1998 | Earl Moon

| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re

Re: Solder Balls

Electronics Forum | Fri Aug 21 13:43:13 EDT 1998 | Ben Salisbury

| Hello everyone, | I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible s

Re: Solder paste matrix

Electronics Forum | Mon Aug 10 21:41:31 EDT 1998 | Dave F

| What exactly is the criteria needed to determine the right solder paste. I have been fortunate enough in the past to have a solder paste work "halfway" for me and to modify the reflow profile or simply just "drop in" a paste and monkey with the pro

Re: Component Feeder Sizes

Electronics Forum | Fri Jun 19 02:02:01 EDT 1998 | Scott McKee

| I am involved in the purchasing decision (Technical side) of which placement machine to buy. One of the criteria we need to specify is how many feeders, and what sizes. I have a provitional parts list of a job that we are most likly going to build.

Re: SMT training classes and start up equipment

Electronics Forum | Tue May 05 13:44:57 EDT 1998 | Mark Mitchell

Mr. Desrochers; Philips EMT Americas offers a three day course entitled, "Introduction to SMT Manufacturing". The course addresses all major factors that influence the automated SMT assembly process. Topics that are discussed in the course are list

Re: Cleaning Asm. After using noclean flux

Electronics Forum | Thu Mar 19 11:48:56 EST 1998 | Earl Moon

| | | Is there anyone out there required by their customer to clean the finget tab contacts even after using noclean paste? We have been asked to clean even though we don't have any flux residue on the contacts. Any ideas? | | | Mike | | | | Yes a


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