Electronics Forum: csam (Page 1 of 3)

CSAM Machines

Electronics Forum | Wed Mar 01 03:29:12 EST 2006 | AMS

Hello, We want to purchase a used CSAM machine for our lab. Could anybody direct us a good source for this? AMS

Dye and Pry on PoPs?

Electronics Forum | Tue Aug 16 07:51:16 EDT 2011 | a

C-SAM is a non-destructive alternative that a lot laboratories and chip manufacturers use. Dye and Pry would work I suppose although I have never done it in practice with PoP but it should be any different for PoP.

Dye and Pry on PoPs?

Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman

Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also

CSAM

Electronics Forum | Wed Mar 15 11:29:38 EST 2006 | cjd

Anybody ever use SAM to inspect a bare pcb? What can you see? Is the scatter noise so bad you can't even see the copper layers? I would think you could at least see to some depth and then flip the board over. I work in a R&D environment so speed

BGA In-circuit Failure Analysis

Electronics Forum | Mon Jun 08 10:45:25 EDT 1998 | Henry Hickey

How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pres

Component failure analysis

Electronics Forum | Thu Aug 11 08:23:29 EDT 2005 | jbragg

Hi Peter, I'm not sure where you're located, but I work for Celestica in our Component Failure Analysis and Reliability Testing Lab in Toronto Ontario Canada. We are an idenpendent lab with full FA component, assembly and PWB capabilities and would

X-Ray Inspection of Plated PCB - Need Your Input

Electronics Forum | Thu Dec 17 18:08:41 EST 2009 | lynn_norman

Back in a former life, we had 3 products that were PCBs bonded to aluminum boards. We used a PSA from 3M to bond the board to the aluminum. Polymers are almost invisible in x-ray, but ultrasound worked quite well. You should try CSAM. Don't know

Re: BGA In-circuit Failure Analysis

Electronics Forum | Mon Jun 08 14:52:46 EDT 1998 | Mike

| How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr

Re: BGA In-circuit Failure Analysis

Electronics Forum | Mon Jun 08 16:20:43 EDT 1998 | Earl Moon

| | How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can

Re: BGA In-circuit Failure Analysis

Electronics Forum | Mon Jun 08 12:42:01 EDT 1998 | Earl Moon

| How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr

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