Electronics Forum: cte (Page 1 of 13)

CTE

Electronics Forum | Sun Jun 13 09:01:39 EDT 2010 | rajeshwara

What role CTE plays in BGA soldering?

CTE

Electronics Forum | Mon Jun 14 16:56:12 EDT 2010 | davef

physics and hos*

CTE mismatch

Electronics Forum | Thu Sep 14 14:37:45 EDT 2000 | Serrena Carter

Does anyone know where I can find good rule of thumb information on soldering/brazing. I am most interested learning the maximum recommended CTE mismatch between two different materials that thermally cycle between 25-100C.

CTE Versus Tg

Electronics Forum | Mon Dec 18 18:14:20 EST 2000 | Dave F

In older resin materials used in printed circuit board fabrication, there seemed to be a direct relationship between CTE and Tg. Now with more modern resins that reationship no longer appears clear. Please comment.

Poor Solderability on TSOPs with Alloy 42 Leadframes

Electronics Forum | Wed Jun 29 17:38:16 EDT 2005 | GS

Several years ago, we had almost same pbm, best results have been obtained by using water soluble paste (those time the old AM1208). Any way, to get a good toe meniscus is not so easy. Talking about CTE, keep in consideration the internal die of TSO

CBGA CTE Mismatch

Electronics Forum | Thu Aug 17 22:22:29 EDT 2000 | C.J. Long

Hi erverybody: I am from a PCB shop. One of our product is with 19 X 19 ceramic BGA and my customer is experiencing 0.1 - 04 % failure of open trace on cornoer BGA pad. Substrate is FR4 with TG 135 degree C and delta Tg is well below 3 degree C. Tra

Re: TCE for Ais

Electronics Forum | Thu Jun 25 11:47:39 EDT 1998 | Steve A

| Hi there, | Does any one know what is TCE for fully wet saturated FR4. I came to know that for Dry FR4 the TCE is about 15-19 PPM �C. Is that true? | | Appreciated for your help. | rgs, | chiakl Chiakl, It looks like you are speaking of what could

BGA rework

Electronics Forum | Tue Mar 09 20:08:08 EST 2004 | davef

Warping BGA are the usual cause of shorts in the corners and are usually caused by the reflow profile. BGA have a natural tendency to warp due to CTE and package thermal mismatch, as you have seen at rework. The PBGA will go from a bowl shape to an

BGA ball Separation

Electronics Forum | Mon Dec 05 17:03:15 EST 2005 | russ

Ina ddition to the above it can be from CTE mismatch and the joints are breaking during cooling. Is this an Altera part?

UBLOX Tim-4A reflow problem

Electronics Forum | Sun Dec 17 17:40:49 EST 2006 | darby

Thanks AJ, It is looking like a CTE issue.

  1 2 3 4 5 6 7 8 9 10 Next

cte searches for Companies, Equipment, Machines, Suppliers & Information

Jetting Pump for Integration

IPC Certification Training from the comfort of your home or office
Flux-Free Reflow Soldering

Training online, at your facility, or at one of our worldwide training centers"
Solder Paste Dispensing

MSD Dry Cabinets
Hot selling SMT spare parts and professional SMT machine solutions

SMT & PCB Equipment - MPM, DEK, Heller, Europlacer and more...