Electronics Forum | Thu Dec 14 10:14:04 EST 2000 | PeteB
Jacqueline, Asuming you mean immersion silver: Advantages - Very flat finish compared to HASL, more easily solderable than bare copper with OSP and more process tolerant than this in our experience, reasonable shelf life, cheaper than immersion gol
Electronics Forum | Wed Dec 13 20:30:59 EST 2000 | Dave F
Immersion Silver PCB Surface Plating - Dennis VanBuren 14:21:24 02/01/2000 [Wudja mean "not much luck" searching the archives? What is this haggis???][Is that like saying "what is this chopped liver??"]
Electronics Forum | Fri Aug 01 08:10:29 EDT 2008 | scotceltic
Has anyone come across a standard or study (JEDEC, IPC) where it has the recommended shelf life outside of a dry box for immersion silver coated PCB's to prevent oxidation from affecting the soldering process (Both reflow and Wave). I know it will
Electronics Forum | Thu Aug 24 13:20:24 EDT 2000 | Murad Kurwa
One of our divisions is having this problem: - De-wetting on the smt pads and componenent termination on the bottom side after top side procssed through reflow. Board finish is immersion silver. ? Any recommendation on what we should check & verify
Electronics Forum | Tue Jun 05 21:14:10 EDT 2001 | davef
You aren't going to post our stuff on your "Hey, I'm the wizard site", are you? Board fab, Pad coatings, OSP 1 OSPs: Imidazole (Via Systems) is good. Entek (Enthone) works, but requires strict thickness control in fab. 2 Enthone CU56 allows one t
Electronics Forum | Sun Aug 03 08:27:41 EDT 2008 | davef
IPC-4553, Specification for Immersion Silver Plating for Printed Circuit Boards, 1.4.1 Solderability. This primary function of IAg is to provide a solderable surface finish, suitable for all surface mount and through-hole assembly applications and wi
Electronics Forum | Wed Apr 26 03:32:29 EDT 2006 | saaitk
Hi all, Has anyone any experience they can share with regard to pad dissolution on PTH's on thick boards. We are using lead free SAC305 on both OSP and Immersion silver finishes and are experiencing difficulties when removing and replacing connector
Electronics Forum | Fri Aug 25 05:23:46 EDT 2000 | Wolfgang Busko
Hi Murad, like with many other questions it�s hard to judge without seeing the effect. Assuming that this site you�re talking about is well equiped with knowledge and that they handle their processes normally to everybody�s satisfaction it�s obvious
Electronics Forum | Mon Dec 22 19:43:43 EST 2003 | Dean
I have seen this affect on Immersion Tin and OSP. 70 to 90 % of the solder wicks to the lead and forms a "single" homogenous solder mass. This even though the pad was 100 % covered with paste... Evaluated different solder paste...did find variatio
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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