Electronics Forum: cu-osp and leadframe (Page 1 of 1)

CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 12:17:56 EDT 2000 | mike weekes

We are considering alternative Board Finishes to our existing HASL process. The HASL effects opens on 25 and 20 mil packages after reflow and we know if the advantages of CuOSP and other alternatives. OUR Concern: Is there a shelf life and handlin

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 21:15:46 EDT 2000 | Dave F

From the SMTnet Library try: http://www.merix.com/resourcecntr/papers/osp.doc http://www.merix.com/resourcecntr/papers/hasl_alt.doc http://www.itm-smt.com/articles.html * "Organic Solderability Preservatives" * "OSPs - Better Living Through Modern Ch

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.

Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va

Re: Palladium Pillows and Bad Dreams

Electronics Forum | Wed Feb 25 09:40:31 EST 1998 | Doug Romm

Steve, TI does not produce any SOTs using Palladium finish leadframes. I would certainly be interested to know who is. Also, your observations are correct: In TI experience the mechanical strength of the solder joints with Pd finish ICs is alw

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