Electronics Forum: cu-osp on leadframe (Page 1 of 1)

Wrinkle solder ball on BGA PKG

Electronics Forum | Sat Dec 30 04:23:50 EST 2023 | 012band

I have used LTS (Sn57.6%Bi0.4%Ag) solder balls for soldering on Ni/Au pads, and I have observed a wrinkle pattern on the ball surface. When you attempted soldering on CuOSP substrate pads under the same conditions, the surface appeared normal. Additi

Non-wetting on QFP lead

Electronics Forum | Wed Nov 21 19:45:36 EST 2001 | Yngwie

Hi Guys, I need help. I�ve a trouble with non-wetting problem on the lead of 208 pin, 20 mils pitch QFP. We are on intrusive reflow. I never faced this problem before on this product after running them for about 2 years now. This occurred on one pa

Poor Solderability on TSOPs with Alloy 42 Leadframes

Electronics Forum | Thu Jun 23 00:28:42 EDT 2005 | KEN

....how does the part perform in a wetting test. Is it solderable on a bench or dip-plating in a pot? If you add flux and heat can you fix your problem assemblies? If yes, plating finish or substrate is not your problem. What flux are you using?

Poor Solderability on TSOPs with Alloy 42 Leadframes

Electronics Forum | Wed Jun 22 09:12:57 EDT 2005 | bsudak

Our manufacturing site has been struggling with soldering Alloy 42 TSOPs. Currently, we have to hand solder in one of our applications. Here are the particulars. Component: 54 leads, Sn plated, 400microinches +/-200. Process: Eutectic 63/37 Sn/Pb

Poor Solderability on TSOPs with Alloy 42 Leadframes

Electronics Forum | Wed Jun 22 09:42:51 EDT 2005 | davef

Not sure what a higher Tg laminate will accomplish. Can't hurt though. Remember, when soldering to Alloy 42, the surface is 42% nickel. So, you need to raise the reflow temperature some 15 to 20*C over what is needed for copper. Also, sometimes All

Poor Solderability on TSOPs with Alloy 42 Leadframes

Electronics Forum | Mon Jul 04 09:01:22 EDT 2005 | Rob

Hi, I don't know if it will help but we talked about soldering Nickel on this thread: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=8051&#Message31803 where we used Cobar solder paste for soldering all types of

Poor Solderability on TSOPs with Alloy 42 Leadframes

Electronics Forum | Wed Jun 29 17:38:16 EDT 2005 | GS

Several years ago, we had almost same pbm, best results have been obtained by using water soluble paste (those time the old AM1208). Any way, to get a good toe meniscus is not so easy. Talking about CTE, keep in consideration the internal die of TSO

Poor Solderability on TSOPs with Alloy 42 Leadframes

Electronics Forum | Tue Jun 28 12:12:17 EDT 2005 | Paul

I'm with DaveF on this one. I think you'll be trying solve this one for a long time. Alloy42 just doesn't like to be soldered. What exactly is the issue? Lack of a toe fillets at on the cropped lead? There is no spec for a toe fillet other than to

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R

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