Electronics Forum | Sat Dec 30 04:23:50 EST 2023 | 012band
I have used LTS (Sn57.6%Bi0.4%Ag) solder balls for soldering on Ni/Au pads, and I have observed a wrinkle pattern on the ball surface. When you attempted soldering on CuOSP substrate pads under the same conditions, the surface appeared normal. Additi
Electronics Forum | Wed Nov 21 19:45:36 EST 2001 | Yngwie
Hi Guys, I need help. I�ve a trouble with non-wetting problem on the lead of 208 pin, 20 mils pitch QFP. We are on intrusive reflow. I never faced this problem before on this product after running them for about 2 years now. This occurred on one pa
Electronics Forum | Thu Jun 23 00:28:42 EDT 2005 | KEN
....how does the part perform in a wetting test. Is it solderable on a bench or dip-plating in a pot? If you add flux and heat can you fix your problem assemblies? If yes, plating finish or substrate is not your problem. What flux are you using?
Electronics Forum | Wed Jun 22 09:12:57 EDT 2005 | bsudak
Our manufacturing site has been struggling with soldering Alloy 42 TSOPs. Currently, we have to hand solder in one of our applications. Here are the particulars. Component: 54 leads, Sn plated, 400microinches +/-200. Process: Eutectic 63/37 Sn/Pb
Electronics Forum | Wed Jun 22 09:42:51 EDT 2005 | davef
Not sure what a higher Tg laminate will accomplish. Can't hurt though. Remember, when soldering to Alloy 42, the surface is 42% nickel. So, you need to raise the reflow temperature some 15 to 20*C over what is needed for copper. Also, sometimes All
Electronics Forum | Mon Jul 04 09:01:22 EDT 2005 | Rob
Hi, I don't know if it will help but we talked about soldering Nickel on this thread: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=8051Message31803 where we used Cobar solder paste for soldering all types of
Electronics Forum | Wed Jun 29 17:38:16 EDT 2005 | GS
Several years ago, we had almost same pbm, best results have been obtained by using water soluble paste (those time the old AM1208). Any way, to get a good toe meniscus is not so easy. Talking about CTE, keep in consideration the internal die of TSO
Electronics Forum | Tue Jun 28 12:12:17 EDT 2005 | Paul
I'm with DaveF on this one. I think you'll be trying solve this one for a long time. Alloy42 just doesn't like to be soldered. What exactly is the issue? Lack of a toe fillets at on the cropped lead? There is no spec for a toe fillet other than to
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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