Electronics Forum | Mon Sep 21 20:45:55 EDT 2009 | davef
10.4. Pre-Cure Examination. Immediately after material application, the uncured conformal coating shall be examined for: a. Bubbles and Air Entrapments. These defects shall be broken by vacuum, with a sharp probe, or other appropriate tools. b. Bridg
Electronics Forum | Tue Sep 22 08:53:37 EDT 2009 | stepheniii
The only time I ever saw problems with stenciling glue was when one know it all operator was using IPA to clean the stencil. He didn't seem to be able to understand that alcohol was a curing agent for that particular glue. But other than that, as l
Electronics Forum | Mon Sep 28 15:36:29 EDT 2009 | davef
While you're waiting for others to reply, search the fine SMTnet Archives to find threads like: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=56260
Electronics Forum | Mon Nov 02 22:02:01 EST 2009 | boardhouse
Umar - the boards are not assembled - so Solder splash is not applicable. Solder resist does not Melt it cures. As a board supplier I would not want my clients to adapt if they are receiving crap product, I would expect them to leave.
Electronics Forum | Thu Nov 19 05:18:37 EST 2009 | prodivegsr
Hi All, Recently we are working on the conformal coating process using Humiseal chemical 1B73 and thinner 521. Bubbles on component body/joints are seen after gone through the IR Reflow Oven. During the conformal coating, only tiny bubbles seen af
Electronics Forum | Sun Nov 22 18:40:47 EST 2009 | 89jeong
Hi The bubble shows only around component body after ir reflow. I think bubble means that there is a moisture. How do you dry the PCB(?) before IR reflow? Thanks Ju-young.
Electronics Forum | Sun Nov 22 19:53:10 EST 2009 | prodrivegsr
Hi Ju Yong, The PCB are dry in an airseal cabinet(Staging Chamber) before IR Oven. The bubbles show at around body and solder joint area. You mean the moisture will create bubbles ? Able to advice the humidity and temperature that you are using in
Electronics Forum | Mon Nov 23 15:26:35 EST 2009 | davef
confo* and bubb*] to fine threads like: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=59681
Electronics Forum | Wed Dec 02 09:04:48 EST 2009 | sforman1
Josh: This is your choice. It wouldn't be mine. Again, I have been doing this for well over 40 years (http://www.m-coat.com) Sam
Electronics Forum | Thu Jan 21 19:04:54 EST 2010 | jldowsey
We used to use Scotch DP460 for Apache helicopter electronics, and we mixed it with Cab-o-sil silica (texas snow) to thicken it so that it doesn't creep during cure.
