Electronics Forum | Sun Jul 26 05:43:21 EDT 1998 | Amr Sokkary
Dear sirs, please help me to fing a company whicjh produces white or yellow adhesive UV curing glue for SMT components assembly ,i need names and contact fones and faxes for those company ,i need any company but not Alphametal or heraues thanks a
Electronics Forum | Mon Jul 27 21:05:36 EDT 1998 | Dave F
| Dear sirs, | please help me to fing a company whicjh produces white or yellow adhesive UV curing glue for SMT components assembly ,i need names and contact fones and faxes for those company ,i need any company but not Alphametal or heraues | th
Electronics Forum | Mon Jul 27 21:05:26 EDT 1998 | Dave F
| Dear sirs, | please help me to fing a company whicjh produces white or yellow adhesive UV curing glue for SMT components assembly ,i need names and contact fones and faxes for those company ,i need any company but not Alphametal or heraues | th
Electronics Forum | Wed Jun 17 14:45:45 EDT 1998 | Bob
| Does any one wave solder the 0402 Chips on the bottom side of a board? | Any comments? You will need to use a curable epoxy at the site of placement before placing the 0402--then cure the epoxy...possible problems are epoxy intrusion on the lands
Electronics Forum | Wed Jun 17 16:00:47 EDT 1998 | Frank
| | Does any one wave solder the 0402 Chips on the bottom side of a board? | | Any comments? | You will need to use a curable epoxy at the site of placement before placing the 0402--then cure the epoxy...possible problems are epoxy intrusion on the
Electronics Forum | Thu May 28 08:39:13 EDT 1998 | Rob Williams
I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not able
Electronics Forum | Thu May 28 08:38:43 EDT 1998 | Rob Williams
I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not able
Electronics Forum | Wed Dec 10 14:37:47 EST 1997 | Frank Murch
There is a direct relationship between adhesive strength and surface area. If you graph this it will be linear. The amount of the adhesive should be about 2/3 the gap between the pads. Pad designs change all over so a true and tried rule does not ex
Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony
I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde
Electronics Forum | Thu Nov 22 08:30:59 EST 2001 | krs
I have heard of this but do not have direct experience. Immersion tin is susceptible to moisture absorption particularly after washing off solder paste. So it sounds like your boards are picking up the solvent off the screen. Water rinse or degrease
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