Electronics Forum | Tue Sep 10 15:27:30 EDT 2013 | gbarb
I have a design that requires the PCBA to be potted. However I have a shrouded header on the board that I need access to. Is there a way to cover this header during the potting process and then removed the cover after the potting material has cured
Electronics Forum | Fri Oct 18 11:56:22 EDT 2013 | hegemon
You might try testing prior to using the Silicone if possible. Also you might try to qualify your cleaning process rather than the individual board. Clean an unrelated assembly and test it in your Ionagraph. Assuming it passes, Clean your subject a
Electronics Forum | Wed Mar 19 08:38:13 EDT 2014 | davef
I can't picture much of what you're saying, not for nothing, I'm just not connecting. During assembly, solder mask can affected by heat and chemicals. Typically this would be during: * Soldering * Cleaning I will tell you this: Not to defend assem
Electronics Forum | Tue Mar 25 13:55:05 EDT 2014 | horchak
Ok lets put it this way. If the PCB house used a high quality mask and properly applied it to a properly cleaned surface and properly cured it, then as Dave stated above there are only two things that can destroy it. Excessive heat and overly aggress
Electronics Forum | Mon May 09 11:29:05 EDT 2016 | jpal
I wanted to bump this up. I am having the same problems. I cannot convince folks it is a solder mask issue and not our process issue, even though it shows up after wave and wash. I can heat the boards and even send them back through the wave preheate
Electronics Forum | Wed Mar 04 10:59:24 EST 2015 | jpierre
Hi first DS65 version is a specific dilution for dispensing machine, in this case the typical process is following: application of the conformal coating extraction of solvent (low extraction power is better)2minutes and drying the drying can be done
Electronics Forum | Wed Jul 22 06:58:50 EDT 2015 | migliore
Hi, I got the answer from edaboard.com A standard 6-layer stack is using 2 cores. Manufacturing steps for standard 6-layer are: 1. Etch both (double side) core substrates 2. Assemble, press and cure the complete stack: - copper foil - prepr
Electronics Forum | Thu Feb 25 18:14:46 EST 2016 | rgduval
They're open ended on the thickness (read that as, have no clue). They've indicated that they would like the coating to protect the circuitry from ESD, and mechanical shock. They also would like to be able to see the LED's through the material. An
Electronics Forum | Thu May 18 03:15:32 EDT 2017 | wama
We are soldering wire 26AWG to jack socket. However after went through washing, baking, coating, curing processes the wire breaks (at joining point with jack socket) during wire dressing. We have tried to increase and decrease the solder amount but r
Electronics Forum | Sun May 13 16:35:07 EDT 2018 | mattkehoe
Hello all you SMT Netters! Please see if you can help us out. We have a older MPM SPM printer in great shape but it has one problem, and it is something I remember happening before but I cannot remember what to do to fix it. It happens when the tab
