Electronics Forum: current (Page 181 of 378)

Lead free Solder Paste troubles !!!!

Electronics Forum | Fri Oct 01 13:37:27 EDT 2004 | rkevin

Well Thanks for all the good advise. Lots of different opinions on this one. I took the advise to contact my current supplier of solder paste. They sent in one of their tech people along with a sales guy and we ran without much trouble. Other than a

Calculating Reflow Slope

Electronics Forum | Tue Oct 05 17:37:21 EDT 2004 | mikecollier

We currently use a KIC 2000 system to profile on our oven and create our recipes. I had a customer in today reviewing our profiles, and he had concerns that we were exceeding 4 deg. c/sec. on our profiles. The process window parameters that we use

RFMD RF2114 Power Amp replacement

Electronics Forum | Thu Oct 21 13:31:41 EDT 2004 | LarryL

With the current failures of the Medium Power Linear Amplifier manufactured by RFMD (PN: RF2114), can anyone recommend a replacement part. The above part is used in a GPS transmitter, where I only have one recommended part on the part list. The manu

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Wed Nov 03 09:42:31 EST 2004 | dramos1

Hi Simon, Thanks for the immediate reply. We really appreciate it very much. Currently, we are using Class 2 for the visual inspection criteria of our telecom boards. In IPC-A-610 Rev. C criteria, there are TARGET, ACCEPTABLE and REJECT criterias.

Electrovert Bravo 8105 Cooling Zone Chiller

Electronics Forum | Thu Nov 18 16:09:12 EST 2004 | ms

Hi Everyone. Are many of you using Bravo 8105 reflow ovens with chiller units? What have your experience been like with them. Are they reliable? If you had the choice would you get another? Is having them an advantage with lead free production?

Esec Micron2 vs. RD Automation CDB-50

Electronics Forum | Fri Dec 10 18:02:45 EST 2004 | Sam El.

I was wondering if anyone has had any experience with either the Esec Micron 2 or the RD Automation CDB-50? We currently have a Micron 2 (1997 build). We are using it for small batches of flip chip. We use the waffle pack feeder not the wafer loader.

Pre-bake of Polyimide flex ? ?

Electronics Forum | Wed Dec 22 23:29:57 EST 2004 | KEN

Check with Dupont's web site. They have a wealth of information on the various polyimide products they manufacture. I was quite surrised at the differences in materials and in particular the dimensional stability and hydroscopy. Good stuff mayna

Storage Conditions for Finished Goods

Electronics Forum | Mon Jan 10 13:59:54 EST 2005 | mdemos1

Hi. I am looking for information on storing completed PCBAs in a warehouse environment. My current assemblies use standard FR4 material - 4 to 6 layers. Component types range from 0402s to fine pitch QFPs and micro-BGAs. If I were to store this i

Lead free profile

Electronics Forum | Tue Feb 01 11:54:14 EST 2005 | TomA

Indy, I found the same findings as you. The claim is that the solder joint may actually look closer to a SnPb solder joint then the SAC alloys. I had commited to the SAC alloys at SMT before finding out about the SN100C alloy. I'm interested in what

Restructuring Rework Process - Back to Basic

Electronics Forum | Tue Feb 01 14:26:34 EST 2005 | rabell

I agree re; "always will be some assemblies that must be repaired". This is unlikely to lessen in the near term with an imminent move toward Lead-free. We are currently working with Cookson, PACE, and BEST developing a course in lead-free rework wh


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