Electronics Forum | Thu Aug 28 09:30:20 EDT 2008 | patrickbruneel
Omid, No-clean fluxes need to be used right out of the can without thinning. In the past with RA and RMA fluxes you could adjust or thin them to your desired density because they had plenty of solids up to 30%. No-Clean fluxes have a lot lower solid
Electronics Forum | Mon Sep 08 01:45:35 EDT 2008 | rameshr
1.The Temperature on the pad is 247.C & also it is an lead free profile, the same profile we have used till last lot but we had obsereved this problem earlier to this current batch. 2. Both in Type3 & Type 4 paste we are using because of we are using
Electronics Forum | Tue Sep 16 15:47:05 EDT 2008 | ismir
Hello everyone! I'm a student of electrical engineering currently working on a thesis for my BSc degree. It will be about post reflow AOIs and AXIs, and I'd kindly like to ask you for some help with it. I would like to know if there are any standar
Electronics Forum | Fri Sep 19 10:24:10 EDT 2008 | jtownsend
I am looking to replace our current smt line of a Contact 3S. This has been our only machine and we have had it for about 6 years. We are looking for 100 plus feeder capacity and 10k plus placement rate with a diverse component range. I am considerin
Electronics Forum | Mon Oct 06 15:04:26 EDT 2008 | mikesewell
I've installed both (at different companies),currently a MPM 125 user. The DEK seemed slightly easier to program a new board. I guess it depends on which platform you're most familiar with. The Hawkeye inspection we had is fast to setup but doesn'
Electronics Forum | Tue Oct 14 19:03:54 EDT 2008 | diesel_1t
currently we have a new Horizon 02i, new software "instinctive" is pretty easy to program and operator friendly, i love to work with proflow. Gridlock is not working so good as they told. I don't like that the paper doesn't roll while you're under cl
Electronics Forum | Mon Nov 24 11:19:21 EST 2008 | sjones
I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen
Electronics Forum | Mon Nov 24 11:26:08 EST 2008 | sjones
I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen
Electronics Forum | Wed Nov 26 03:29:41 EST 2008 | stewartp
I'm currently using 'program maker' to generate SMT programs for our Vitesse. The problem is we were using an old style format for our part numbers.. We have now got a part number system in place, which I now want to add to our vitesse. This will cr
Electronics Forum | Tue Dec 09 18:03:39 EST 2008 | davef
First, you cannot determine foil thickness from its weight per area, because there is significant variation in the density of electrodeposited copper. Second, the official IPC specification for minimum thickness is "after" processing by the fabricat
