Electronics Forum: custom (Page 351 of 408)

Shrinkage in paper phenolic pcbs

Electronics Forum | Fri Aug 23 10:28:23 EDT 2002 | davef

Ah, CHEAP boards. You pay me now, you pay me later, eh? The buyers get BIG bonuses. The production types get trashed, 'cause they can run aboard they've been doing for years. Wassup? For a specification, look to: * IPC-6011 - Generic Performance

PCB's for oven profile testing

Electronics Forum | Wed Aug 28 18:08:07 EDT 2002 | MikeF

This looks like it may be a good application for an Air-Vac or Wenesco type solder station. It is a solder pot that has a small motor to pump solder up through a chimney. You can put different nozzles on the top of the chimney, so you only apply sold

Poor Fuji recognition of PhyComp 0603 (1608) cap

Electronics Forum | Fri Sep 20 20:03:55 EDT 2002 | mjabure

Well chip I ought to leave you guys hanging in the breeze on this one , but here goes. Steve, your assumption that the nozzle is calculated as part of the component body for types 11 & 12 is incorrect. during center test on the 643's one of the par

Where do I Start?

Electronics Forum | Tue Sep 10 09:56:21 EDT 2002 | gregp

I wish I knew where Mr. Fastek worked so I could contact his customer base to tell them his company may not be here in 6 months. I don't know where you get your information but you are reckless with it. These forums should be based on experiences a

aoi

Electronics Forum | Thu Sep 19 16:58:04 EDT 2002 | dragonslayr

You definitely need to have live demos of each system, using your specific assembly if you want to compare apples to apples. Each of the AOI OEM's you mentioned have plus amd minus to their unique systems. You will need to evaluate your specific nee

Most common BGA types

Electronics Forum | Tue Oct 01 16:19:35 EDT 2002 | dragonslayr

Hello all- I am am seeking information to the top 100 BGA grid patterns. I am planning to have a full sheet of stencil foil populated with these most common types. I will cut out the individual grid patterns and create my own mini stencils. In a 27

Soldering an 18 layer 2oz. copper board

Electronics Forum | Sun Oct 20 19:42:29 EDT 2002 | sjpence

Like Russ, I am also curious about the 100% fill requirement. On any thick, high mass board the key is getting as much heat as possible into the board. If you get the board to the proper temperature, solder will flow just about anywhere. As an alte

Used Equipment Support (Registration?)

Electronics Forum | Sat Nov 02 11:38:02 EST 2002 | fastek

Frank- Your point about the OEM's trying to help a small company with thoughts of bigger and better things in the future is a valid point. I've had that same argument with the OEM's for years but for different reasons. You're still missing the poin

Help! BGA Socket / BGA Direct Placement

Electronics Forum | Mon Nov 11 17:32:50 EST 2002 | dphilbrick

We have a tidy clause in our contract where as we are not responsible for functionality of prototypes. With that in mind we do what ever the customer is willing to pay for! Experiment away my boy! Now for my two centavos on your question. Without s

Intrusive Reflow

Electronics Forum | Wed Nov 20 03:52:16 EST 2002 | iman

Hello, need help on intrusive reflow process, thanks in advance to the experts and general info sharing :) need some help to obtain answers, to following questions: 1) PCB is FR4, 1.6mm thick, 4 layers, what stencil thickness (stencil design guide


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