Electronics Forum: damaged tracks (Page 1 of 3)

Track Repairs

Electronics Forum | Thu Nov 27 16:55:31 EST 2003 | johnwnz

Hi Folks, trying to track down if there is a std for the max number of track repairs that you can don on a PCB. IPC 610 gives me an indication of what is acceptable in term's of the amount of damage I can have on a track before it's a fail however n

seperation of soldermask and pcb

Electronics Forum | Tue Mar 18 11:53:58 EDT 2014 | sara_pcb

Our contract manufacturing agency have procured pcbs from approved vendor. After assembly we found solder mask separated from the PCB on the epoxy area as patches. The top side is intact. also over the pcb tracks, the mask got damaged. In what c

Piling/Stacking finished PCBs .......Sigh........

Electronics Forum | Thu Apr 05 11:43:35 EDT 2007 | Colleen

i just did a report on damaged boards from this kind of treatment. Components get rubbed off - sometimes the component just breaks, but often they take pad and track with them.

Chip Die Damage

Electronics Forum | Fri Dec 07 09:54:05 EST 2012 | davef

Try MIL-STD-883 Method 2017 Die inspection service providers may be willing to help Services, Die inspection * Amkor amkor.com * Syagrus Systems syagrussystems.com SMTA has published a lot of papers that track to 'die' & 'inspection' but most oft

mpm ultraprint3000

Electronics Forum | Tue Jan 08 16:25:00 EST 2013 | eduardo3mx

hello I need your help I have a machine mpm ultraprint3000 with the damaged hard drive I made a copy to the hard drive of another machine the same, but I have problems with the x-axis origin does not, either the track center, and the stencil wiper w

Life of a Solder Stencil

Electronics Forum | Mon May 28 04:29:16 EDT 2001 | hello

we met the same problem with audit, and i make a tooling log for each stencil and in tooling log , set up some criteria for checking such as tension , mechanical damage, printing result ect. The stencil will be checked periodicly by process engineer,

QFN Rework Issues

Electronics Forum | Wed Feb 13 10:39:36 EST 2019 | spitkis2

The QFN will add an insignificant amount of thermal mass since its all in the housing. You just need to make sure the package does not exceed the recommended peak and duration so as not to damage the die internally. Usually the limit is around 250-

Life of a Solder Stencil

Electronics Forum | Tue May 08 11:23:11 EDT 2001 | rwilliams

I have been tasked with determining the Life of a Solder Stencil and how to track it. (Basically, how do we know when to replace the stencil, E.g., deterioration of print quality, physical damage, etc.) Obviously there are a lot of variables, but is

Solder printing issues

Electronics Forum | Fri Nov 08 11:37:44 EST 2002 | jonfox

1. Back in the early days of consumer digital cell phones, we ran into the same problem. PCB with 2000 parts in a 5"x2" area, and double sided. We ended up using our standard vacuum tooling for the NIC side and stiff ESD safe foam for the NAC side

BGA,s Storage

Electronics Forum | Wed Nov 07 17:13:51 EST 2001 | fmonette

Hany, The guidelines for proper handling and storage of moisture sensitive components, like PBGAs are clearly documented in the joint IPC/JEDEC standard J-STD-033 (free download at http://www.jedec.org). In short you need to keep track of exposur

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