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Used SMT Equipment: datacon 2200apm die bonder (Page 1 of 1)

Besi / ESEC Datacon 2200 Evo 8800FC ,2200

Used SMT Equipment | Assembly Accessories

we need Besi Die Bond: Type: Datacon 2200 Evo 8800FC ,2200 APM+

Dong Guan Hong Cheng Import &Export Co.,Ltd

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High Throughput Reflow Oven

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"IPC training online, at your facility, or at one of our worldwide training centers including our brand-new training center in the Twin-Cities area of Minnesota. Blackfox Training."

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