1881 dave and f results

Electronics Forum: dave and f (Page 41 of 189)

Re: SMT Additive Process

Electronics Forum | Wed Jan 26 07:40:15 EST 2000 | Dave F

Dennis: We stepped stencils on the board side to accomidate additive jumpers. They work fine. The steps are not close enough to affect fine pitch devices. Please describe how the stencil is sffected in the area of your FP devices. Dave F

Re: RF absorber

Electronics Forum | Tue Jan 25 09:33:00 EST 2000 | Dave F

Try: AI Technology 70 Washington Rd Princeton Junction, NJ 08550 609) 609-799-9388 Fax: 609-799-9308 www.aitechnology.com/enter.html ait@aitechnology.com Good luck Dave F

Re: RF absorber

Electronics Forum | Wed Jan 26 10:33:56 EST 2000 | Haim B.

Hello Mr Dave F Thanks very much. I forget to mention that the material is not electricaly cunductive. Haim B

Re: AOI inspection

Electronics Forum | Tue Jan 25 07:30:00 EST 2000 | Dave F

Robert and Nazeem: Consider contacting your equipment supplier and asking them for a customer list. It's to the suppliers' advantage to help you develop your knowledge base. Dave F

Re: Via-in-pad

Electronics Forum | Mon Jan 24 08:11:00 EST 2000 | Dave F

Jeff: Whoa bud. I'm sorry. Leave the pads as they are. The calculation was intended to increase the aperture for the pad with the via to compensate for the paste starving caused by the via. Sorry for not being clear. Dave F

Re: SMT Chip terminal lifted

Electronics Forum | Wed Jan 19 11:52:34 EST 2000 | Dave F

PC and Erico: Are yinns talking: 1 A component that will not lie flat on the board? 2 A component that will lie flat to the board that you can't get to solder to the pad? 3 A pad that is no longer attached to the board? 4 Something else. Whazit?

Re: Mid Chip Solder Balls

Electronics Forum | Mon Jan 17 10:55:44 EST 2000 | Dave F

Interesting point Mark. We prefer solder mask between pads to reduce bridging. How does removing solder mask between pads eliminate solder balling? Thanks Dave F