Electronics Forum | Thu Mar 23 22:20:51 EST 2000 | Dave F
Chris: I'm unsure about the kits you seek. Solderability of: * Components: J-STD-002, Dip And Look Method. Malcom Instruments makes a very nice tester. * Boards: IPC TM-650 2.4.12A Solderability, Edge Dip Method Good luck Dave F
Electronics Forum | Tue Mar 21 20:30:48 EST 2000 | Dave F
Marc: Experimental evidence is rare. Published reports are rarer. I can�t comment on the impact of rework on your RF boards. I can tell you that: � HF is pretty LF these days. � We allow three rework actions on each aboard. � IPC-7721 is a fine s
Electronics Forum | Sat Mar 18 07:33:34 EST 2000 | Dave F
Jack: Two concerns with column devices: 1 Coplaniarity of the device and the board. 2 Adequate solder that you mentioned, becuase the columns will not be reflowing and you need to cloatthem with solder. You didn't describe your aperture, but even
Electronics Forum | Mon Mar 20 08:50:47 EST 2000 | Dave F
Scott: Pyros don't like to be heated, so soldering should be done as quickly as possible. Other tips are: * Keep pyro leads long. * Apply solder to the ends of leads. * Heatsink the lead, while soldering by holding the lead with a pair of pliers
Electronics Forum | Fri Mar 03 10:12:41 EST 2000 | Dave F
Jack: "Calculator/Other" works for me. But you know what, I'll bet they block Scotts from using it, because they're reputed to be too cheap to buy the standard. ;-) (Your component is in the standard. ;-)) If you can't get the supplier to help and
Electronics Forum | Wed Mar 01 17:07:50 EST 2000 | Dave F
Brian: Several things: � Many CAD systems offer compliant pad design libraries � Look at IPC-SM-782 "Surface Mount Design And Land Pattern Standard" � Some times, component manufacturers have the best information about pad designs for their compone
Electronics Forum | Sat Feb 26 09:22:19 EST 2000 | Dave F
Jason: Assuming you wantto reuse the TSOPs, two things come to mind: 1 Don't bend the leads. This can be caused by not melting the solder on all leads at the same time. 2 Don't break the body. This can be caused by moisure absorbed by the case ex
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Thu Feb 24 21:47:22 EST 2000 | Dave F
Interesting, Gary. Try this: 1 Assess candidate solders by reviewing J-STD-006 (http://canfieldmetals.com/j-std006.htm) to determine solder formulations that have liquidous temperatures in the desired range. 2 Request recommended profiles from supp
Electronics Forum | Thu Feb 24 13:12:38 EST 2000 | Dave F
Ver: The best thing I could do is send you to Bob Willis' site (www.bobwillis.co.uk or something like that), suggest that you root-around there and find one of his procedures that will help you, and come back and we'll refine your process. Good luc