Electronics Forum | Fri Aug 06 07:18:48 EDT 1999 | Graham Naisbitt
| | | | | Has anyone out there tried to parylene coat plastic parts prior to soldering them to a pcb? I'm looking at several potential applications where fewer than 5% of my components on a pcb are plastic, yet from a reliability aspect (environmenta
Electronics Forum | Mon Jun 25 11:09:26 EDT 2001 | wbu
Who is this, another Dave F ? For me there�s no problem with balling and beading. I know that the boards I have with the new paste do have all what�s needed for balling and beading, just one of the oldest designs with a stencil ...., oh boy, didn�t
Electronics Forum | Wed Feb 02 11:48:48 EST 2000 | Christopher Lampron
Dave, Ashok mentioned that the end termination of the component were dull and grey. I have had similar problems with Murata components exibiting the same characteristics on the end terminations. As it turns out, they have some exotic plating material
Electronics Forum | Fri Jan 14 16:58:20 EST 2000 | Dave F
Dave: You're probably correct about too much paste, given that your balling is congrigated near the center of the chips. Three things to consider: 1 Lower temperature profile @ front 3 zones 2 I've heard some stencil suppliers can plate addition
Electronics Forum | Fri Dec 17 12:09:09 EST 1999 | Boca
Outstanding advice gentlemen! To borrow Dave F's line "I'd like to take a bit of a different angle." Ie. a few wave solder specific issues If this assembly is going over wave solder then avoid vias under passive components, it invites solder bal
Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F
Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process
Electronics Forum | Wed Sep 01 14:15:27 EDT 1999 | Dave F
| Help | | I have just received some PCBs with external tracks entering SMD pads at all angles, tangents + 45 degs etc. | | Where can I obtain information as to how tracks should enter SMD pads.? I have looked at several IPC books and got some mino
Electronics Forum | Wed Aug 18 21:24:55 EDT 1999 | Dave F
| CEERIS has been sending me flyers for some time, touting the value of their various studies and insights gained from digesting the facts contained within. The topics are indeed of great interest. My question is to whomever of you has purchased one
Electronics Forum | Wed Aug 04 14:34:50 EDT 1999 | Dave F
| Has anyone out there tried to parylene coat plastic parts prior to soldering them to a pcb? I'm looking at several potential applications where fewer than 5% of my components on a pcb are plastic, yet from a reliability aspect (environmental condit
Electronics Forum | Fri May 21 14:22:56 EDT 1999 | Dave F
| Dave, | i tried reflowing bare boards with only solder printed on em and no component placed. we still got voids as same as when components were placed. so atleast one of that theories(voids due to component/component placement)could be considered
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