Electronics Forum | Tue Apr 11 20:31:54 EDT 2000 | Dave F
Russ: You�re correct. I should have explained our reasons for preferring concave over convex better. First, we use both also ... we just prefer concave because they: * Don�t bridge any where near as easily. * Self-center better. * Seem to have mor
Electronics Forum | Wed Mar 29 17:10:25 EST 2000 | Jon Wentz
Hi Dave, What feeder model do you have? I took a quick look in my parts list manual and again, depending on your feeder model, you might be able to buy the needed part(s) from Zevatech/Juki. Have you checked with them yet? For example, the main feed
Electronics Forum | Mon Mar 27 20:52:22 EST 2000 | Dave F
Marc: In printed circuit board fabrication, fabricators place sheets of prepreg between each pair of glass cores. They stack these layers into books. As they heat and press the books, the sheet melts into an epoxy glue. The thickness of the prepr
Electronics Forum | Mon Mar 27 21:25:01 EST 2000 | Dave F
Pete: Two angles on your question: 1 Yes, the layout of your board can affect the level of bridging you see. 2 That aside, the set-up of your machine also can affect the level of bridging on your board. Shaw, I could set-up your machine to bridge i
Electronics Forum | Tue Mar 21 20:36:11 EST 2000 | Dave F
Armin: Boca makes some good points about release. So, let me spin this up from a different angle ... SM-782 suggests "full radius corners" as an alternative to the more familiar square corner pads on PLCC, TSOP and QFP. We see both also. We thin
Electronics Forum | Thu Mar 23 20:31:45 EST 2000 | davef
Hey Cartman: Recently, I was over at a plant that does ICT on RMA fluxed boards and asked them about flux residue on test probes. The test machine operators: * Think flux residues are a pain in the gluteus maximus. * Change probes (from a collectio
Electronics Forum | Wed Mar 15 20:28:17 EST 2000 | Dave F
Armin: Locating vias within the courtyard of components is bad practice. Concerns are: * Poor solder paste print quality, caused by the via preventing good stencil gasketing. * Poor component reflow, caused by the via holding the component out o
Electronics Forum | Mon Mar 13 14:41:22 EST 2000 | Boca
By Hot Air Knife I assume (leave it alone Dave F.) that you mean a debridging knife located at the exit end of a wave solder machine. Russ is right, they are not a good substitute for a good process, but once the process (w/o HAK) is developed, it
Electronics Forum | Mon Mar 13 14:45:01 EST 2000 | Boca
By Hot Air Knife I assume (leave it alone Dave F.) that you mean a debridging knife located at the exit end of a wave solder machine. Russ is right, they are not a good substitute for a good process, but once the process (w/o HAK) is developed, it
Electronics Forum | Thu Mar 09 20:48:30 EST 2000 | Dave F
Van Hoang: Welcome to SMTnet!!!! Regarding your problems: 1. Cleaning glue: Check the SMTnet archives. For instance, a recent thread was: cleaning glue off of stencils - pr 13:41:43 03/03/2000 2. Bridging on the wave: Bridging on the wave h
