Electronics Forum: dave (Page 271 of 327)

Re: Misalignment during reflow

Electronics Forum | Thu Nov 11 14:13:57 EST 1999 | Dave F

Thomas: From what you're telling us, you seem to be thinking correctly: 1 Paste should not spread appreciably in preheat 2 Something has changed, because you've not had this problem, until recently Two things to consider: 1 Has any thing changed

Re: paste release from stencil, and volume calculation

Electronics Forum | Tue Nov 09 17:12:38 EST 1999 | Dave F

Steve: Addressing your points: 1 FINE PITCH APERTURES Electropolishing Laser Cut Stencils: Laser cut should not requiring polishing. Geesh, how much money do you have for stencils? ;-) Oval Shaped Apertures: Pass. What do you expect to gain f

Re: paste release from stencil, and volume calculation

Electronics Forum | Sat Nov 13 14:09:45 EST 1999 | se

First, let me say what I always say: a good chem-etched stencil will print fine pitch. Chem-etch brings trap to the side walls because its a physical by-product of the process. Because they are less expensive you can add electropolish and still save

Re: flow thru

Electronics Forum | Tue Nov 02 17:52:17 EST 1999 | Dave F

Jim: Several points: 1 If you�re correct about corrosion of your component leads (which is entirely possible if the leads are steel, as you say), then the AIM 264-5 no-clean may not be aggressive enough to remove the corrosion you are seeing routin

Re: How are your solder balls @ wave solder ?

Electronics Forum | Mon Oct 11 13:05:51 EDT 1999 | Dave F

| | Folk's, | | | | I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. | | I was wanting to do a straw poll on you guy's as to the type of resist's yo

Re: Top Side BGA Reflowing @ Wave Solder

Electronics Forum | Fri Oct 08 16:36:59 EDT 1999 | Dave F

| We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost 7

Re: bottom side epoxy

Electronics Forum | Thu Oct 07 09:59:01 EDT 1999 | Dave F

| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

Re: Pay scale

Electronics Forum | Mon Oct 04 10:53:48 EDT 1999 | Dave F

| What is the average pay that a SMT Programmer would get? The machines would be Fuji and Universal. | Bubba: The points made by others about company size and location are pertinent. Further, you should consider the "complete package" of salary an

Re: Help I need DATA on Thermal shock caused by REWORK!

Electronics Forum | Fri Oct 01 16:17:10 EDT 1999 | Dave F

| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at


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