Electronics Forum: dave (Page 86 of 327)

Min spacing for land patterns from PCB edge

Electronics Forum | Thu Mar 20 10:59:59 EDT 2008 | fsw

Thnx Dave! I have not seen anyone as yet using fixtures to support brds while using Pizza cutters. Will check it out.

RoHS round 2

Electronics Forum | Thu Mar 27 15:19:07 EDT 2008 | ck_the_flip

Will clay, rock, and paper provide sufficient signal carrying capabilities without degrading signal strength or transmission speed, and further, will these materials exceed tensile strengths of traditional "metallurgical" solder joints? DaveF? Patr

Safety Glasses

Electronics Forum | Tue Apr 01 10:50:47 EDT 2008 | Mr. Sexy Specs

Thanks Dave, I really like your third suggestion! I'll have to use that for our ISO and TS Auditors!

expired solder paste

Electronics Forum | Fri Apr 04 01:39:21 EDT 2008 | slthomas

All of what Dave says is spot on. I suspect that the most likely corresponding defects on your assemblies would be poor wetting and insufficient solder.

What happens to LPI Solder Mask on the RF4 PCB During Reflow?

Electronics Forum | Mon Apr 21 14:04:24 EDT 2008 | arminski

Hi dave, sorry for my late reply...right now do not have info about the LPI and I'm not allowed to talk to our supplier without going through our sales people...sux! cheers!

Gold thickness

Electronics Forum | Fri Jul 11 02:42:40 EDT 2008 | aj

Thanks Dave, IPC-6012 states min at 0.05um. Has this been a update or is it for a different class? thanks, aj...

Contamination under chip resistor array

Electronics Forum | Thu Aug 21 08:15:07 EDT 2008 | naynayno

Thanks Dave, I will be sticking with Manufacturing Engineering. These are good guidelines but what is standard clearance for various packages? This is a dimension we usually seek by eye, whether we will have a problem or not. We use straight DI -

looking for HASL TIN thickness specification

Electronics Forum | Wed Sep 03 11:52:58 EDT 2008 | stepheniii

But Vlad was talking tin and Davef gave intermetalic thicknesses which Vlad said needs to be avoided by having a few microns of tin. I'm not 100% sure but I suspect that DaveF is not convinced that Vlad knows what "intermetalic" means.

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Wed Sep 10 12:43:13 EDT 2008 | patrickbruneel

Dave, I don't think you will get a response in the mean time he found the right knobs to fix the problem. Sorry couldn't resist

SMT Text Book

Electronics Forum | Tue Oct 21 11:04:48 EDT 2008 | arosario

Hi CK / Dave, Thanks for the book. I'll try to get one for this. Hope this will help a lot. CK, you're right I'm from Philippines but I'm based now here in Beijing.


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