Electronics Forum | Wed Nov 14 04:36:33 EST 2018 | components
2 article may help you sort: https://www.allchips.ai/blog/electronics-forum-and-community-for-engineers 13 Electronics forum and community for engineers https://www.allchips.ai/blog/10-electronic-components-news-websites 10 Electronic Components New
Electronics Forum | Wed Sep 24 08:34:57 EDT 2003 | stefwitt
Even when you run a board several times, the machine may not make the same travel path every time. This in itself does not create a problem, but the vacuum on the nozzles could be different, dependent on the configuration of components on the heads.
Electronics Forum | Fri Sep 13 15:39:54 EDT 2002 | DANIEL
Are there very many companies that send there smt components out to be put on tape and reel
Electronics Forum | Fri Sep 26 12:57:09 EDT 2003 | Angie
We have had some components that popped off in our IR oven. It was attributed to the solder paste. The humidity was above 60% the temp was about 70 degrees.
Electronics Forum | Tue Sep 17 19:11:46 EDT 2002 | melo_guy
My company does all T&R and value added options in house.
Electronics Forum | Mon Sep 16 12:55:27 EDT 2002 | davef
We send parts out to be tape & reeled. We do not send all loose parts out to be tape & reeled. As you would expect, we base our decision on: * T&R service company lead time * Our production schedule * Cost benefit of T&R versus some other productio
Electronics Forum | Tue Sep 23 23:19:34 EDT 2003 | RLW
If you have a board that you've run several times, now you run it and like before all settings are the same, but now you have 0603's randomly skewed or an inch or so away from their intended pad (as if popped up in the air), or an occasional 7343 cap
Electronics Forum | Mon Apr 16 10:01:03 EDT 2012 | patrickbruneel
*Like*
Electronics Forum | Mon Jan 12 18:06:38 EST 2004 | Kris
Hi, Is there any standard for voids in a leaded device or a chip component ? IPC 7095 lists maximum allowable voiding for BGA devices but has no information on leaded devices Appreciate your help- thanks
Electronics Forum | Tue Jan 13 22:07:42 EST 2004 | davef
No, there is no such information. Choices are: * Recognize that any voiding is a process indicator and that when observed, indicate a requirement for taking corrective steps. * Tell your quality people to quit looking at components other than BGA wi
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