Electronics Forum: de and wetting (Page 1 of 17)

Black color solder wetting after reflow

Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs

Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t

Conformal coating mask dots and halos

Electronics Forum | Mon Mar 01 09:17:56 EST 2010 | duso02

Hey....I think it might be the silicone adhesive! LOL Yeah, that'll do it. We use simple Shercon paper dots. Work like a charm. No evidence of "de-wetting".

0402 tombstoning and dewetting on QFP256 trade-off

Electronics Forum | Fri Mar 06 10:50:21 EST 2009 | fountain42

Just my opinion but it look's like your doing a great job. i would try another paste. I'm somewhat lucky that we get to use OA's. If your stuck using the no-cleans they are so tempermental. (The nitrogen is making up for the poor paste) Your de-wetti


Electronics Forum | Mon Jul 28 05:35:17 EDT 2008 | surendra268

What could be the main reasons for De-wetting in reflow process. Can anybody answer

Indium No-clean and Inert Reflow oven (N2)

Electronics Forum | Thu Aug 01 13:04:57 EDT 2002 | gdstanton

Its interesting. It appears I'm getting conflicting feeback from Indium. This says its not a problem... http://indium.custhelp.com/cgi-bin/indium.cfg/php/enduser/std_adp.php?p_sid=kTDKGClg&p_lva=&p_faqid=355&p_created=1014734692&p_sp=cF9ncmlkc29

De-wetting on Immersion Silver finish board

Electronics Forum | Thu Aug 24 13:20:24 EDT 2000 | Murad Kurwa

One of our divisions is having this problem: - De-wetting on the smt pads and componenent termination on the bottom side after top side procssed through reflow. Board finish is immersion silver. ? Any recommendation on what we should check & verify


Electronics Forum | Mon Jul 28 05:48:17 EDT 2008 | mattkehoe

What could be the main reasons for De-wetting in > reflow process. Can anybody answer Normally it is a contaminated surface finish.

PDBE and PBB replacements???

Electronics Forum | Mon Mar 21 09:33:25 EST 2005 | davef

RoHS Substance||RoHS MCV Limits||Typical Testing Approaches Lead||1000 ppm* ||Wet chemical digestion followed by ICP (Inductively coupled plasma) or AAS (atomic absorption) spectroscopy ||||XRF (X-ray fluorescence) spectroscopy Cadmium||100 ppm ||Wet

black and grey pad

Electronics Forum | Sat Oct 06 05:33:47 EDT 2001 | spchua

I had recently encounter the "black and grey" pads problems for the BGA pad after the convection re-flow. The pads shows in in "black and grey" color and a litter solder in it, and it happen in ramdom, when applied heat and solder on the "black and g

RoHS and stencils

Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane

i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red

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