Electronics Forum | Thu Jun 16 11:48:00 EDT 2016 | ttheis
I agree that if you end up with a machine that needs more repair than one in good condition is worth, then you have a boat anchor. That is what I am looking to avoid with this next purchase as I don't have much experience with auto printers. Your inf
Electronics Forum | Sat Apr 28 21:13:11 EDT 2018 | stephenj37824
So lots of quotes and research later we have eliminated a few added a few to our choices lol. So it looks like we will be doing a decent volume now (due to our other board supplier letting us down as well). Roughly 4-5 million leds/connectors per mon
Electronics Forum | Thu Aug 29 15:51:21 EDT 2019 | spoiltforchoice
&gt; If quality or Reliability is the key.... BTU, <BR> &gt; Soltec Vitronics..Rehm... If it is the money <BR> &gt; ...probably not these brands.....:) <BR> <BR> Well I
Electronics Forum | Tue Jan 28 16:34:34 EST 2020 | spoiltforchoice
I genuinely think component verifier on the machine is the optimum solution. Even then it can probably get caught out, we build some instrumentation that can have 10K 1%, 10K 0.1% and 10k 0.1% 2ppm, a verifier won't catch those getting mixed up,likew
Electronics Forum | Wed Mar 24 23:12:48 EDT 2021 | grahamcooper22
0.66 area aspect ratio...so for example...if the device is 0.5mm pitch QFP, the pcb pad may be 12 thou wide..make the aperture 9 to 10 thou wide...and reduce it's length by 10 % overall compared to the pcb pad.... Depending on device pitch, select ap
Electronics Forum | Tue Mar 13 16:05:30 EST 2001 | rob_thomas
Hi, can you definitely attribute the 30%yield to poor bga soldering? What is your high flyer defect encountered on the failed boards.Is this ICT ,flying probe ,functional test yield? Can you determine a defect pattern? Did your subcontractor provided
Electronics Forum | Thu Jul 29 11:14:46 EDT 1999 | Justin Medernach
| I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. | | The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the
Electronics Forum | Fri May 07 08:06:03 EDT 1999 | Hon Choi
| | Hi all, | | | | We're starting up tests for pin-to-paste and, well, things could be better. We're testing different pastes and we're testing different apertures rules and, well, we're still testing. It's coming close and we're getting pretty
Electronics Forum | Wed Apr 28 12:48:02 EDT 1999 | Justin Medernach
| | | We use Immersion Gold (AuNi) for our 20 mil pitch and BGA boards. | | | Lately, we have been having solderability problems with boards with this surface from some of our suppliers. | | | | | | We are considering trying boards with White Tin so
Electronics Forum | Wed Nov 04 02:53:53 EST 1998 | Earl Moon
| Micheal, | | What does your profile look like for the wave? What profile does your flux say you need? My guess is it is not your profile, our testing with solder balls found that the mask on the boards was the largest contributor to solder balls
