Electronics Forum | Tue Apr 18 08:05:00 EDT 2000 | Wister
Hi, I got an interesting result after completing DOE that more open defects occurred higher the viscosity.The ppm would be 500 while the viscosity is 950 and it would be 1500 while the viscosity is 1050.The range of viscosity is 900 ~ 1100kcps. The p
Electronics Forum | Wed Jan 31 17:45:37 EST 2001 | dason_c
Hi! William, please check the new IPC-A-610 Rev C, para 12.4.10 for the soldeirng anomalies. Most of them may consider as process indicator and not the defect. The most common method to elimate the solder ball is to reduce the solder volume by red
Electronics Forum | Tue Mar 13 02:18:07 EST 2001 | JT
Biggest problem with the IIF is placing components with varying thickness (i.e. multpile vendors). We have to adjust production programs at start of each run to prevent excess scrap. Line Sensor tolerances can be adjusted to accept a wider range of
Electronics Forum | Fri Mar 30 07:14:42 EST 2001 | pteerink
Genny, Xray systems ( or at least what I have seen ) are a manual based system. That is, you put the board on the machine and look at certain locations that you want to inspect. What we have in mind is an automated system that will catch obvious, no
Electronics Forum | Fri Mar 30 07:14:51 EST 2001 | pteerink
Genny, Xray systems ( or at least what I have seen ) are a manual based system. That is, you put the board on the machine and look at certain locations that you want to inspect. What we have in mind is an automated system that will catch obvious, no
Electronics Forum | Mon Apr 23 07:19:23 EDT 2001 | dahsr
Can I have solder bridging two SM rectangular chip components due to misalignment? The bridging occurs at one end and is on a common trace between the two pads. The components are larger than the pad (side overhang) and are aligned rather perfectly w
Electronics Forum | Thu Oct 26 16:38:08 EDT 2000 | Philip A. Reyes
Hi Sir Charles! Good Day! I hope you can help me about my queries. 1. What is the acceptable misregistration or misalignment of balls after reflow soldering of PBGA module on the PCB? 2. Is there any criteria for solder ball defect or solder beads
Electronics Forum | Thu Jul 20 16:23:08 EDT 2000 | Bob Willis
We set up and ran this process at Nepcon UK with some success but we used a UV adhesive less than 10sec cure so no heat. Push off force for the biggest parts was over 800 grams. We have had to modify the design rules a little to make it work but it
Electronics Forum | Thu Jul 20 12:18:02 EDT 2000 | Dave F
Bob: We are trying to improve the decision making process used by our Material Review Board (MRB). We have a fairly standard defect identification and MRB process. In this we: * Identify problems in components and assemblies. * Segregate problems
Electronics Forum | Tue May 08 13:39:27 EDT 2001 | genny
Thank you for your response. I have been told that x-ray strength is finding solder volume and pattern root cause defects, and will catch a high % of them - opens, shorts, insufficient solder, and missing components(shape of solder on pad w/o lead i
