Electronics Forum: defect (Page 156 of 226)

Re: Control the solder paste

Electronics Forum | Tue Jan 11 07:46:23 EST 2000 | Dave F

Wolfgang: Boy it's tough to convey context in this medium, isn't it? Clipped from our paste storage work instruction, environmental effects on paste are: 1a Avoid excessive heat (over 80� F). It causes flux separation, reducing print quality. 1b

Re: Wave Soldering 0603

Electronics Forum | Tue Dec 21 18:09:24 EST 1999 | Brian W.

I have been soldering 0603 components on the bottom side using a glue and wave solder process for a long time. Bridging has not been a common problem. However, it is inherent on the design engineers to follow good manufacturability planning when la

Re: Nitrogen to use or not to use

Electronics Forum | Thu Dec 16 11:54:45 EST 1999 | Mike Naddra

At reflow an inert atmosphere is used to mitigate the occurance of oxidation, to me the decision weather to move from an inert atmosphere is based on several things ; PCB surface finish - are you using a HASL finish, OSP or another surface finish and

Re: Solder Reflow Problem

Electronics Forum | Thu Nov 04 10:07:32 EST 1999 | Wolfgang Busko

Sometimes when using a new pot of paste you get one which isn�t good at all without any noticable appearance at first sight. You might try a new one. Despite the fact that you run the same profile as usual a defect of the oven of any kind unnoticed c

Re: Calculate SMD movement during reflow?

Electronics Forum | Wed Nov 03 10:30:27 EST 1999 | John Thorup

Hi Anthony I'm not sure I understand your question. Do you mean move to a better or more precise placement or to an error or bad position? I'm not aware of any calculation that can predict movement since it is based on so many factors like component

Re: 0603 Solder Beads

Electronics Forum | Mon Nov 01 22:16:20 EST 1999 | chartrain

Your problem is common on this solder defect. It is sometimes known as squeeze balls. The formation of these result from excess volumes of paste applied to the pads. Once the paste melts and covers the pad and component termination,the excess has no

Industry SMA's for evaluation

Electronics Forum | Wed Oct 20 15:47:14 EDT 1999 | Shane

I am developing a D.O.E for Surface Mount Adhesives and was wondering if anyone out there had any recommendations on a certain brand. I currently have samples of Loctite 3609, 3615, 3618, Heraeus PD955M and MA-420 by Lord Chemicals. I understand Ci

Re: Solder Paste Trial

Electronics Forum | Thu Oct 07 18:24:01 EDT 1999 | Jason Gray

Make sure you check the MSDS for the new paste. If you have more than one production line, I'd suggest a gradual changeover. One selling point for management would be the free training Multicore will give you for the switch. If you haven't already

Re: Solder Paste Trial

Electronics Forum | Thu Oct 07 20:43:16 EDT 1999 | Dave F

| Make sure you check the MSDS for the new paste. If you have more than one production line, I'd suggest a gradual changeover. One selling point for management would be the free training Multicore will give you for the switch. If you haven't alrea

Re: Solder Paste Trial

Electronics Forum | Thu Oct 07 21:07:45 EDT 1999 | Bix

| | Make sure you check the MSDS for the new paste. If you have more than one production line, I'd suggest a gradual changeover. One selling point for management would be the free training Multicore will give you for the switch. If you haven't alr


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