Electronics Forum | Mon Apr 09 14:53:19 EDT 2007 | flipit
Hi, We were running with few defects with lead solder paste. The lead solder paste with stencil 0.010" X 0.020" and 0.004" thick stencil produced near defect free PCB assys. 0.010" X 0.020" (0.004" thick) lead = defect free 0.010" X 0.020" (0.005"
Electronics Forum | Mon Jul 16 10:44:29 EDT 2007 | Jacky
Hi All, Recently, we encountered strange defect at our SMT line. We can see solder ball spatter around at one of the component pad. This lead to insufficient solder defect at 1 side of the component. The other side of the component look good(Meet
Electronics Forum | Fri Jan 04 07:54:24 EST 2008 | benzy1961
My experience has been very different from the other responders. We put an in-line system in place about 3 months ago and the results have been pretty eye-opening. We were astounded to see how many prints were actually bad once we started inspectin
Electronics Forum | Tue Sep 09 11:53:36 EDT 2008 | davef
We consider "IR-reflow soldering profile" to be the supplier's recommended reflow thermal profile that a component temination 'sees' for proper soldering, regardless of the method used to reach that temperature. When you say, "We have a lot of defec
Electronics Forum | Fri Mar 26 11:31:34 EDT 2010 | rway
I have been using ICT for a number of years. It is still a viable resource for catching defects in the production process. AOI doesn't catch everything, such as bridging on QFN or J-lead devices (this will depend on the type of AOI and camera syste
Electronics Forum | Tue Oct 04 11:54:49 EDT 2011 | davef
We'd like to help you, but we don't have a clue of what you're talking about. * Which 'heatseal' machine are you using? Is that a reflow soldering machine? See, we think of a heatsealing machine as one that bond the two sides of a plastic bag togethe
Electronics Forum | Fri Feb 17 11:48:25 EST 2012 | davef
Here's a link to an earlier thread on SMTnet that may add something to the conversation http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=20871 Allowing fabricators to X-Out boards is a bad idea. * X-Outs are randomly placed * Machines can
Electronics Forum | Sun Sep 21 10:03:15 EDT 2014 | gascon5383
hi, there is an IPC standard, IPC-A-610 - Acceptability of Electronic Assemblies. According to this manual, solder in the bends of a lead does not matter, but solder touching the body of a component is a defect. I cannot find a specific reference in
Electronics Forum | Tue May 10 09:54:35 EDT 2016 | reinhardk
Hi all, kindly asking for some hint with a problem we encounter with our SPI: After inspection, the SPI should show the defect details, but it doesn't. I can see the files created by the realtime-card in the exchange-directory between windows- and
Electronics Forum | Tue Aug 06 16:49:57 EDT 2019 | jmedernach
HI, The short answer is, "whichever machine finds your defects." I would suggest evaluating machines based on a common vehicle. Make a bad board and identify the defects. Make a good board and have your vendor teach and tune the machine to the goo
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