Electronics Forum: defect (Page 71 of 226)

Blistering issue, mixed LF/SnPb process

Electronics Forum | Fri Jul 28 08:51:50 EDT 2006 | russ

Are all these defects related to the trace that enters pad? Looking at #2, the good fillet has side trace entry and the bad has front entry. I would suggest that a profile check is in order, then the paste would be next culprit. Russ

Blistering issue, mixed LF/SnPb process

Electronics Forum | Fri Jul 28 09:33:14 EDT 2006 | pavel_murtishev

Oven is controlled properly. We run a lot of products at this line. Moreover, same problem appeared at other production line (ovens are different). Yes, problem is new; I never saw this defect before. BR, Pavel

Solder paste life cycle inside incubator

Electronics Forum | Tue Aug 15 15:48:20 EDT 2006 | Chunks

No longer than when it starts to cause defects unacceptable to company goals and/or objectives.

BGA Solder Acceptance Criteria

Electronics Forum | Wed Aug 30 21:59:47 EDT 2006 | YQ Deng

Dear Davef, Sorry for late reply! CMK is a PCB supplier, BGA solder defect were found in CMK PCB. is there other method to verify the BGA soler criteria, such as reliability test?

Quad/SMTech/MPM 400 printer question

Electronics Forum | Mon Oct 23 19:00:30 EDT 2006 | cadcopac

Have you tried to clean the lens at the tip of the pen? Use alcohol should work like new unless it is defective. Ours was driving me nuts till the brainwave hit and has been working ever since. Good luck. John

Too much solder paste cause tombstoning?

Electronics Forum | Sun Nov 26 08:21:41 EST 2006 | callckq

Dear All, Is anyone know why too much solder paste might cause tombstoning defect? Thanks

AOI: Agilent vs. Omron vs. MIRTec/YESTech?

Electronics Forum | Tue Nov 28 17:13:38 EST 2006 | ebert

Hi Lou, If real process control and useful defect data is what you're looking for, Orbotech has some of the best tools available out there.

ENIG-BLACK PAD!!!!

Electronics Forum | Fri Dec 08 00:02:35 EST 2006 | Jack

Hi all, I found this article (Dealing with "the black pad defect)about reworking bare PCB with black pad symptom...Use HASL to treat black pad..Have you guys try this before?? www.smta.org/files/SMTAI01-Jay

Yield on 0402 SMT Printed Circuit Board Assemblies

Electronics Forum | Tue Jan 02 18:04:18 EST 2007 | russ

way too low of yield. with that technology on the board I would expect about 98% as well. So what are the defects? and more importantly, is your design, machine(s) and/or process(s) capable of this technology? Details I am sure are forthcoming R

BGA opens

Electronics Forum | Wed May 02 06:56:52 EDT 2007 | Rob

Has anyone experienced deformed balls on BGAs - especially very low volume build to order devices? I'm looking into a possible hidden pillow defect and think I have eliminated most of the other factors I believe could cause it. Cheers, Rob.


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