Electronics Forum | Fri Aug 27 13:07:44 EDT 2004 | C Lampron
Hello, I believe that the area's of concern are primarily component related. Some component are rated for a temp (usually 260 degrees max) for some length of time. Tant Caps come to mind as being heat sensitive. The other concern would be the inerme
Electronics Forum | Mon May 05 03:53:41 EDT 2003 | praveen
Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.
Electronics Forum | Mon May 05 03:53:47 EDT 2003 | praveen
Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.
Electronics Forum | Fri Jun 07 14:05:39 EDT 2024 | davidk
I wanted to open a discussion and ask about opinion: What is a normal result of the inspection of an AOI? How many falls calls per component /opportunity is bad/normal/good? How many defects per component/opportunity is bad/normal/good? What is goo
Electronics Forum | Wed Jun 19 14:40:58 EDT 2024 | davidk
Hello Carl, Thank you for your comment Obviously, we are evolving and debugging our test to get the best results ("no escapes no false calls") :) and using a combination of 3D and 2D tests. With the previous AOI, we had a much higher false call rate,
Electronics Forum | Wed Jun 19 15:28:58 EDT 2024 | davidk
Hi Tom, Thank you for your comment 75% FPY is also our target, cause we gonna have the AOIs in the SMT line. So you would expect more opportunities? I didn´t notice but there are not so many components with high opportunity rate. (the average numbe
Electronics Forum | Thu Jun 13 08:10:51 EDT 2024 | carl_p
You would need to be more specific on the AOI in question here. 2D, 3D features will also have a big impact. Are you constantly evolving or updating the models to improve the situation or going from just the base program as if low volume it can be a
Electronics Forum | Thu Jun 13 14:41:40 EDT 2024 | tommy_magyar
Hi David, In one of my previous jobs I worked as an AOI/AXI process engineer and we had a set target of 75% FPY. This means that 75% of the boards at IPC Class 3 standards would not have a single false call. This also means you would need to set y
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Fri May 03 21:56:31 EDT 2019 | pcbindex1
How to improve the rate of defect of automotive PCB?
