Electronics Forum | Fri Aug 27 13:07:44 EDT 2004 | C Lampron
Hello, I believe that the area's of concern are primarily component related. Some component are rated for a temp (usually 260 degrees max) for some length of time. Tant Caps come to mind as being heat sensitive. The other concern would be the inerme
Electronics Forum | Mon May 05 03:53:41 EDT 2003 | praveen
Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.
Electronics Forum | Mon May 05 03:53:47 EDT 2003 | praveen
Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Fri May 03 21:56:31 EDT 2019 | pcbindex1
How to improve the rate of defect of automotive PCB?
Electronics Forum | Sat May 04 12:43:48 EDT 2019 | davef
ISO/TS 16949 is a quality management system for automotive sector
Electronics Forum | Mon Sep 16 13:29:37 EDT 2013 | larrygroves
a lot depends on the age and type of equipment you are using . Older equipment can have a lot of problems with smaller parts. If all is well with your feeders and machine you should expect something like 99.8 to 99.9 percent. some parts will be ident
Electronics Forum | Fri Feb 11 02:42:17 EST 2005 | marakas
Thank you very much for your answer. We had: 1- 224 pins, size 19*19 mm, pitch 0.8 mm 4- 48 pins, size 11*7 mm, pitch 0.75 mm 1- 160 pins, size 15*15 mm, pitch 1 mm 1- 196 pins, size 15*15 mm, pitch 1 mm How many defects I should expect with th
Electronics Forum | Thu Feb 10 09:09:30 EST 2005 | russ
99% (there will always be that one that gets jacked somehow). Your old placement equipmment may affect this by dropped parts that get underneath the BGA, etc.. hopefully the placement accuracy will at least get the parts halfway on pad and they will
Electronics Forum | Sat Feb 05 05:10:53 EST 2000 | Dean
It would be helpful to have some additional info on your line and process. Lets make some assumptions... Consider: re-tooling costs for your fab supplier. Can your supplier hold the additional tollerences for a larger panel. Can your supplier fab
