Electronics Forum: dek process capability (Page 1 of 88)

Print process capability

Electronics Forum | Mon Mar 03 08:16:00 EST 2003 | martys

We are using MPM and DEK printers, what are the critical variables for measuring print process capability?

Print process capability

Electronics Forum | Mon Mar 03 09:16:09 EST 2003 | msivigny

Hello martys, The critical variables to measure print process capability on any printer are its ability to securely clamp a board, accurately align the board to its mating stencil, print with appropriate squeegee pressure and follow print material gu

Wavesoldering capability study

Electronics Forum | Tue Jul 10 11:49:20 EDT 2007 | samir

Parallelism tends to drift: �h After preventative maintenance �h From dross buildup or other obstruction clogging either wave Parallelism should at least be studied during the process characterization stage, so that you know your machine's process

Wavesoldering capability study

Electronics Forum | Thu Jul 05 21:46:53 EDT 2007 | davef

Here are the basics of determining that your process is in control and capable - http://lorien.ncl.ac.uk/ming/spc/spc9.htm There are tons of stuff like this on the web.

Wavesoldering capability study

Electronics Forum | Thu Jul 05 10:11:19 EDT 2007 | ck_the_flip

The variables to study: * Dwell Time * Contact Length * Conveyor Speed * Parallelism * Top-side Substrate Temperature Before wave * Solder Pot temperature All of these variables are inter-related (ie changing one variable will affect another)

Wave solder capability study

Electronics Forum | Thu Jul 17 20:20:12 EDT 2008 | davef

Wave set-up DOE * Immersion depth [1/3 to 2/3 of board thickness] has the least impact of any variable in wave soldering. * Contact length the greatest impact. * Control flux density, time through preheaters, top side temperature as the board reaches

Placement equipment capability study ?

Electronics Forum | Wed Nov 21 11:30:48 EST 2007 | cyber_wolf

Has anyone been involved in SMT placement equipment capability studies? I was wondering if anyone has procured used equipment and performed capability studies on the equipment and received quality and cost benefits from the resulting data. They

SMT process consultants

Electronics Forum | Mon Oct 15 10:53:21 EDT 2001 | Stefan

I would not mind some more business either. Although capable of installing all machine brands, I would like to restrict my expertise in the large vendor of German placement machines. stefwitt@netzero.net

BGA flux dipping process

Electronics Forum | Tue Jun 02 22:19:17 EDT 2009 | mikehe

We have been doing BGA's for years now, and I would suggest updating your profile and place a thermal couple on the BGA, keep in mind the bigger the part the more heat it will need, We stencil print all of BGA's from simple bga's to complex ones, you

BGA flux dipping process

Electronics Forum | Tue Jun 16 14:46:25 EDT 2009 | grantp

Hi, If your using NXT to place these BGA's then you must be doing large runs. BGA's are the most easy part to place, and don't worry about them. Just stencil paste down for them as any other component. But we use 1:1 reduction on our stencil, so we

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