Electronics Forum: delamination and criteria (Page 1 of 6)

Blistering and delaminating boards

Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1

Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di

QFN's and LGA's

Electronics Forum | Wed May 20 17:18:09 EDT 2009 | daxman

Just out of curiosity, how are you or anyone else determining a defect? Last I checked, IPC had no criteria yet for solder defects for QFN components. Has this changed? Biggest problems we see are voids which our x-ray shows a lot of. Our problems

QFN's and LGA's

Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist

I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i

Touch-up and Inspection Process

Electronics Forum | Thu Mar 03 09:04:26 EST 2005 | russ

Been following this thread and have a question, Why do "touch-up" people follow different criteria than "Q.C." people. It sounds like the root of the problem is not addressed but bandaids are being put into place. We have no "Q.C." department and

Re: IQ/OQ, and PQ

Electronics Forum | Wed Sep 15 11:08:45 EDT 1999 | Dave F

I am looking for help on doing smt equipment qualifications. I need to find some examples to follow. The equipment to be qualified is a Stencil Machine, Pick and place machine, and Reflow oven. We manufacture medical devices so it has to be somewha

UPS and ROHS Compliance

Electronics Forum | Thu Jun 15 18:15:34 EDT 2006 | nickel

If you have time, download the free Practical Guide to Understanding the Scope of the WEEE and RoHS, you will find what they say about UPS. They consider UPS out from the field of application of RoHS. ORGALIME (Bruxelles)is the European Engineering

Heat guns and component damage

Electronics Forum | Tue Jan 31 13:41:12 EST 2006 | outgasser

We are currently experiencing problems with delamination during rework/2nd op activity on lead free. I am suspecting this is a result of the use of a heat gun to rework components. My assumption is that the high heat and time in area greatly increa

Dye and Pry on PoPs?

Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman

Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Wed Nov 03 09:42:31 EST 2004 | dramos1

Hi Simon, Thanks for the immediate reply. We really appreciate it very much. Currently, we are using Class 2 for the visual inspection criteria of our telecom boards. In IPC-A-610 Rev. C criteria, there are TARGET, ACCEPTABLE and REJECT criterias.

Pick and Place Machine Validation

Electronics Forum | Thu Mar 10 12:19:17 EST 2005 | rlackey

Borrow a large hungry dog (or wolf if local wildlife permits) & chain it up in the corner of the office when the salesman comes in. Then look over at it repeatedly whilst talking about your requirements. Feel free to leave him alone for a while...

  1 2 3 4 5 6 Next

delamination and criteria searches for Companies, Equipment, Machines, Suppliers & Information

best reflow oven

Inspection mirrors for electronic rework and repair.
Jetting Pump for Integration

Best Reflow Oven